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pro vyhledávání: '"Yung Shen Wu"'
Autor:
Shih-Chieh Chang, Yung Shen Wu, Chih-Ming Kuo, Wei-Hsin Wu, Chuan-Yu Wu, Kung-An Lin, Lung-Hua Ho, Chih-Hsien Ni, Chia-Jung Tu, Fei-Jain Wu
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Fine-pitch three-dimensional (3D) interconnects have become a favored choice for next-generation packaging technology, helping to meet industry demands for small form factors, large bandwidth, and low power requirements in electronic devices. Critica
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4ca919321d113b9f87aec26bce64ee1c
https://doi.org/10.1109/ectc.2014.6897305
https://doi.org/10.1109/ectc.2014.6897305
