Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Yung Jean Rachel Lu"'
Publikováno v:
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
In this paper, we investigate antenna on glass and compare the property with antenna on ceramic substrate at 60GHz band for Wireless Gigabit alliance application. The design of Antenna on Corning EAGLE XG Glass is dependent on the result of simulatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::146ac2751eada27c7a2aed86ce2281df
https://doi.org/10.23919/icep.2018.8374697
https://doi.org/10.23919/icep.2018.8374697
Autor:
Heng-Chieh Chien, Ra-Min Tain, Chun-Hsien Chien, Ming-Ji Dai, Wei-Chung Lo, Yung-Jean Rachel Lu
Publikováno v:
International Symposium on Microelectronics. 2013:000611-000617
In this study, we used simulation technique to analyze the thermal characteristics of solo TGV (through-glass via) structure and solo TSV (through-silicon via) structure. The analysis showed, no matter in in-plane direction or in cross-plane directio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3c826c70202b76fc158582cb0350ff27
https://doi.org/10.4071/isom-2013-wp11
https://doi.org/10.4071/isom-2013-wp11
Autor:
Kuo-Chyuan Chen, Hsiang-Hung Chang, Yuan-Chang Lee, Ching-Kuan Lee, Yung Jean Rachel Lu, Jen-Chun Wang, Chia-Wen Fan, Wen-Wei Shen, Huan-Chun Fu, Chau-Jie Zhan
Publikováno v:
2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
In this paper, we investigate reliability testing for a glass interposer. The test vehicle is an assembled glass interposer with a chip, a BT substrate. The structure of a glass interposer with two redistribution layers (RDLs) on the front-side and o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::13274814741472ba8d69ee6216ec234c
https://doi.org/10.1109/impact.2016.7800011
https://doi.org/10.1109/impact.2016.7800011
Autor:
Yu-Min Lin, Wei-Chung Lo, Huan-Chun Fu, Wen-Wei Shen, Chao-Kai Hsu, Yung Jean Rachel Lu, Chau-Jie Zhan, Hsiang-Hung Chang, Ching-Kuan Lee, Chun-Te Lin, Chun-Hsien Chien, Yu-Wei Huang, Cheng-Ta Ko
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Glass interposer is proposed as a superior alternative to organic and silicon-based interposers for 3DIC packaging in the near future. Because glass is an excellent dielectric material and could be fabricated with large size, it provides several attr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ad8bc9e60608b156ea2ee7e88c6569f1
https://doi.org/10.1109/ectc.2014.6897559
https://doi.org/10.1109/ectc.2014.6897559