Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Yun-Kai Deng"'
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1c99ecd10ac62bb20f334a5ff04340cc
https://doi.org/10.1109/icept56209.2022.9873390
https://doi.org/10.1109/icept56209.2022.9873390
Autor:
Long Zheng, Yun-Kai Deng, Hong-Guang Wang, Guang-Chao Lyu, Bing-Xian Yang, Wei-Lin Hu, Xin-Ping Zhang
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::24984ba98435cbcb8c2ebc4c0650a5f4
https://doi.org/10.1109/icept56209.2022.9873388
https://doi.org/10.1109/icept56209.2022.9873388
Autor:
Hong-Guang Wang, Guang-Chao Lyu, Yun-Kai Deng, Wei-Lin Hu, Bing-Xian Yang, Min-Bo Zhou, Xin-Ping Zhang
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::48cb57d131a8785afc154f5bb7d8ab15
https://doi.org/10.1109/ectc51906.2022.00233
https://doi.org/10.1109/ectc51906.2022.00233
Publikováno v:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
In recent years, the fan-out panel-level package (FOPLP) has attracted increasing attention due to its low cost while maintaining the same advantages of the fan-out wafer-level package (FOWLP) such as high I/O density and excellent performance. Compa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::68e4aeba4b87df1282f2ff18c70eb922
https://doi.org/10.1109/icept52650.2021.9568026
https://doi.org/10.1109/icept52650.2021.9568026
Publikováno v:
JOURNAL OF RADARS. 2:357-366
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2e8d6ddb251313d55887ac06ebcfdeef
https://doi.org/10.3724/sp.j.1300.2013.13031
https://doi.org/10.3724/sp.j.1300.2013.13031
Autor:
Wei Xu, Yun-kai Deng
Publikováno v:
Journal of Electronics & Information Technology. 33:2679-2685
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::12c00c52353268ba9b7b619c70a7abb9
https://doi.org/10.3724/sp.j.1146.2011.00113
https://doi.org/10.3724/sp.j.1146.2011.00113
Autor:
Yun-kai Deng, Wei Xu
Publikováno v:
Journal of Electronics & Information Technology. 33:798-804
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f674769633b7f080b8bb2223b84eaebc
https://doi.org/10.3724/sp.j.1146.2010.00668
https://doi.org/10.3724/sp.j.1146.2010.00668
Publikováno v:
Journal of Electronics & Information Technology. 33:787-791
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c7282dd02811e1536ac123959c71552a
https://doi.org/10.3724/sp.j.1146.2010.00681
https://doi.org/10.3724/sp.j.1146.2010.00681
Publikováno v:
Journal of Electronics & Information Technology. 30:1756-1759
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b4b79b6e9627c6ca01caa07e56d0e28a
https://doi.org/10.3724/sp.j.1146.2006.01958
https://doi.org/10.3724/sp.j.1146.2006.01958
Publikováno v:
Journal of Electronics & Information Technology. 33:484-488
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::06e351f0daf28d93f945f6e484d20974
https://doi.org/10.3724/sp.j.1146.2010.00435
https://doi.org/10.3724/sp.j.1146.2010.00435