Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Yun-Hui. Mei"'
Publikováno v:
Power Electronic Devices and Components, Vol 3, Iss , Pp 100014- (2022)
In this paper, excellent thermo-mechanical reliability of resin-free silver sintering for large-area (20 × 20 mm2) bonding was successfully achieved by using a trimodal particle system composed of nano-, submicron-, and micron-sized Ag particles. Af
Externí odkaz:
https://doaj.org/article/2cfd3a1ba3304c4184e57f4e393d9033
Publikováno v:
IEEE Transactions on Power Electronics. 38:7118-7127
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eb473196c7cfb49379fc8889e02f4d13
https://doi.org/10.1109/tpel.2023.3252266
https://doi.org/10.1109/tpel.2023.3252266
Publikováno v:
Applied Sciences, Vol 12, Iss 9, p 4748 (2022)
Electrochemical migration (ECM) of sintered nano-Ag could be a serious reliability concern for power devices with high-density packaging. An anti-ECM nano-Ag-SiOx paste was proposed by doping 0.1wt% SiOx nanoparticles rather than previously used expe
Externí odkaz:
https://doaj.org/article/c02d6c8d63584d09b26c164136b4c097
Publikováno v:
IEEE Transactions on Power Electronics. 37:10149-10153
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5279169cdaaae1edd5d5e014277e4f1e
https://doi.org/10.1109/tpel.2022.3170067
https://doi.org/10.1109/tpel.2022.3170067
Publikováno v:
Journal of Materials Science: Materials in Electronics. 33:20508-20517
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cf87a6052a1b94ca3e25b696e8ad19f2
https://doi.org/10.1007/s10854-022-08865-8
https://doi.org/10.1007/s10854-022-08865-8
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:707-710
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::08071dac7daea1182d58b0244cfe3b27
https://doi.org/10.1109/tcpmt.2022.3159033
https://doi.org/10.1109/tcpmt.2022.3159033
Publikováno v:
IEEE Transactions on Device and Materials Reliability. :1-1
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a7626fa256150d18ecfba6587bdc8990
https://doi.org/10.1109/tdmr.2023.3272928
https://doi.org/10.1109/tdmr.2023.3272928
Publikováno v:
Materials Letters. 206:1-4
The inhibition effect and mechanism of adding palladium particles to nano-silver paste on the migration of silver in high temperature is reported. The electrochemical migration (ECM) tests showed that silver migration was significantly delayed by the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fae591f22f74314a6c8bd5a82aad1f50
https://doi.org/10.1016/j.matlet.2017.06.066
https://doi.org/10.1016/j.matlet.2017.06.066
Autor:
Shuang-Tao Feng1,2 13207567335@163.com, Yun-Hui Mei1,2 yunhui@tju.edu.cn, Gang Chen3 agang@tju.edu.cn, Xin Li1,2 xinli@tju.edu.cn, Guo-Quan Lu1,4 gqlu@vt.edu
Publikováno v:
Materials (1996-1944). Jul2016, Vol. 9 Issue 7, p564. 17p. 1 Color Photograph, 1 Diagram, 2 Charts, 6 Graphs.
Publikováno v:
Key Engineering Materials. 697:303-306
Fe-Ni@ SiO2core–shell structured micrometer spherical particles with nanometer thick SiO2 shell were fabricated by a facile wet chemical process, their compositions and mechanisms were investigated using x-ray diffraction and Fourier transform of i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e90527f5a46a0005f8a60d908ba6b698
https://doi.org/10.4028/www.scientific.net/kem.697.303
https://doi.org/10.4028/www.scientific.net/kem.697.303