Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Yun-Hui Mei"'
Publikováno v:
IEEE Journal of the Electron Devices Society, Vol 9, Pp 966-971 (2021)
SiC MOSFET allows higher temperature capability with higher switching efficiency than that of conventional Si devices, due to its superior electrical and thermal properties. Nevertheless, there are few reports on the systematic characterization of th
Externí odkaz:
https://doaj.org/article/1f7551f9872045d480a79101136b5ab4
Publikováno v:
Applied Sciences, Vol 12, Iss 9, p 4748 (2022)
Electrochemical migration (ECM) of sintered nano-Ag could be a serious reliability concern for power devices with high-density packaging. An anti-ECM nano-Ag-SiOx paste was proposed by doping 0.1wt% SiOx nanoparticles rather than previously used expe
Externí odkaz:
https://doaj.org/article/c02d6c8d63584d09b26c164136b4c097
Publikováno v:
IEEE Transactions on Power Electronics. 38:7118-7127
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eb473196c7cfb49379fc8889e02f4d13
https://doi.org/10.1109/tpel.2023.3252266
https://doi.org/10.1109/tpel.2023.3252266
Publikováno v:
IEEE Transactions on Power Electronics. 37:10149-10153
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5279169cdaaae1edd5d5e014277e4f1e
https://doi.org/10.1109/tpel.2022.3170067
https://doi.org/10.1109/tpel.2022.3170067
Publikováno v:
Journal of Materials Science: Materials in Electronics. 33:20508-20517
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cf87a6052a1b94ca3e25b696e8ad19f2
https://doi.org/10.1007/s10854-022-08865-8
https://doi.org/10.1007/s10854-022-08865-8
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:707-710
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::08071dac7daea1182d58b0244cfe3b27
https://doi.org/10.1109/tcpmt.2022.3159033
https://doi.org/10.1109/tcpmt.2022.3159033
Publikováno v:
IEEE Transactions on Device and Materials Reliability. :1-1
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a7626fa256150d18ecfba6587bdc8990
https://doi.org/10.1109/tdmr.2023.3272928
https://doi.org/10.1109/tdmr.2023.3272928
Publikováno v:
Power Electronic Devices and Components. 3:100014
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c13a2679e50a9d890335b0a2e652efb6
https://doi.org/10.1016/j.pedc.2022.100014
https://doi.org/10.1016/j.pedc.2022.100014
Publikováno v:
Materials Letters. 206:1-4
The inhibition effect and mechanism of adding palladium particles to nano-silver paste on the migration of silver in high temperature is reported. The electrochemical migration (ECM) tests showed that silver migration was significantly delayed by the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fae591f22f74314a6c8bd5a82aad1f50
https://doi.org/10.1016/j.matlet.2017.06.066
https://doi.org/10.1016/j.matlet.2017.06.066
Autor:
Shuang-Tao Feng1,2 13207567335@163.com, Yun-Hui Mei1,2 yunhui@tju.edu.cn, Gang Chen3 agang@tju.edu.cn, Xin Li1,2 xinli@tju.edu.cn, Guo-Quan Lu1,4 gqlu@vt.edu
Publikováno v:
Materials (1996-1944). Jul2016, Vol. 9 Issue 7, p564. 17p. 1 Color Photograph, 1 Diagram, 2 Charts, 6 Graphs.