Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Yulei Yuan"'
Publikováno v:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
To satisfy the performance gains of the third-generation semiconductors represented by SiC and GaN during use, novel high-temperature operation die-attachment material, Ag, have received extensive attention in power devices for its excellent thermal
Publikováno v:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
As the electronics industry develops, semiconductor devices increasingly tend to be used in high temperature application. Higher working temperature also puts forward new requirement for die-attach materials, copper nanoparticles (Cu NPs) have shown
Publikováno v:
Applied Surface Science. 570:151220
The development of WBG (wide bandgap) semiconductors has put forward higher requirements for packaging and interconnection technology. Cu sintering is widely considered as an advanced interconnection technology which can be used in high temperature a
Publikováno v:
2017 IEEE 17th International Conference on Communication Technology (ICCT).
IP (Internet Protocol) has been tremendously successful over the past decades. Now the networking goal of 4A (Anywhere, Anytime, Anyone, Anything) is becoming a reality. However, there is still a long way to achieve the desired goal of 6R, which is t
Publikováno v:
2016 18th International Conference on Advanced Communication Technology (ICACT).
Moving Target Defense (MTD) has been proposed as a new revolutionary technology to alter the asymmetric situation between attacks and defenses. Network address shuffling is an important branch of the MTD technology. However, there is no systematic in