Zobrazeno 1 - 10
of 21
pro vyhledávání: '"Yul-Kyo Chung"'
Publikováno v:
IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control. 55:1038-1042
Dielectric properties of Ni-coated BaTiO(3)-PMMA (polymethyl methacrylate) composite were studied from an embedded capacitor application viewpoint. Volume loading of up to 50% was attempted, and the results were compared with uncoated BaTiO(3)-PMMA c
Autor:
Hee Young Lee, Hyung-Woo Choi, Eun-Tae Park, Young-Woo Heo, Yul-Kyo Chung, Joon-Hyung Lee, Jeong-Joo Kim
Publikováno v:
Integrated Ferroelectrics. 87:85-93
PMMA-Ni and PMMA-Ni-BaTiO3 composites were fabricated by a two-step mixing and hot-molding method. The effects of the Ni particle size on the dielectric behaviors of the composites were examined. When small Ni particles (4 μ m) were used as a filler
Autor:
Seung-Hyun Sohn, Woon-Chun Kim, Hyung-Dong Kang, Jong-Hyun Park, Cheng-Ji Xian, Yul-Kyo Chung, Soon-Gil Yoon, Hyun-Ju Jin, Jin-Seok Moon, Hyung-Mi Jung, Sung-Taek Lim, Seung Eun Lee, Nak-Jin Seong, Jeong-Won Lee
Publikováno v:
Japanese Journal of Applied Physics. 45:7325-7328
Various bismuth-based pyrochlore films were deposited on copper clad laminate substrates at temperatures below 150 °C by pulsed laser deposition for embedded capacitor applications. The films showed smooth and dense morphologies during deposition at
Dielectric Properties of PCB Embedded Bismuth-Zinc-Niobate Films Prepared by RF Magnetron Sputtering
Publikováno v:
2008 10th Electronics Packaging Technology Conference.
A novel bismuth zinc niobate (Bi1.5Zn1.0Nb1.5O7, BZN) thin film was studied as an embedded capacitor. The BZN thin films were prepared on copper based substrate by RF sputtering, which is compatible with low-temperature PCB processing. The films with
Publikováno v:
2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference.
The BZN thin films on copper clad laminate substrate by RF sputtering were studied for embedded capacitor application in PCB. The deposition was performed without substrate heating and the deposited films are composed of an amorphous phase. The diele
Publikováno v:
2007 International Conference on Electronic Materials and Packaging.
Fiber-reinforced composites are used as insulating layers in PCBs to reduce thermal residual stress and warpage due to their low coefficient of thermal expansion (CTE) and high elastic modulus. The composite prepreg is laminated on patterned copper l
Publikováno v:
MRS Proceedings. 969
Dielectric properties of bismuth-zinc-niobium oxide (Bi1.5Zn1.0Nb1.5O7, BZN) thin films have been investigated for embedded capacitor. Crystalline BZN has a pyrochlore structure in nature and shows a dielectric constant of ∼ 200 and very low leakag
Autor:
Yul-Kyo Chung, Cheng-Ji Xian, Kyung-Chan Ahn, Seong Ihl Woo, Hyung-Mi Jung, In-Hyung Lee, Jeongwon Lee, MK Jeon, Jonghyun Park, Jin-Seok Moon, Sung-Taek Lim, Seung Eun Lee, Seung-Hyun Sohn, Woon-Chun Kim, Soon-Gil Yoon
Publikováno v:
Applied Physics Letters. 90:052903
200-nm-thick BMN films were deposited on Pt∕TiO2∕SiO2∕Si and Cu∕Ti∕SiO2∕Si substrates at various temperatures by pulsed laser deposition. The dielectric constant and capacitance density of the films deposited on Pt and Cu electrodes show
Autor:
Jong-Hyun Park, MK Jeon, Cheng-Ji Xian, Jung Won Lee, Soon-Gil Yoon, Seong Ihl Woo, In Hyung Lee, Seung Eun Lee, Byoung Ikg Song, Kyung-Chan Ahn, Eui-Tae Kim, Yul Kyo Chung
Publikováno v:
Electrochemical and Solid-State Letters. 10:G18
Bismuth magnesium niobate (BMN) thin films deposited on Cu/Ti/Si substrates at 100°C by pulsed laser deposition were investigated for the effect of plasma treatment on dielectric and leakage current characteristics. The dielectric constant and dissi
Autor:
Joon-Hyung Lee, Hee Young Lee, Hyung-Woo Choi, Eun-Tae Park, Yul-Kyo Chung, Jeong-Joo Kim, Young-Woo Heo
Publikováno v:
Applied Physics Letters. 89:132910
Effects of ferroelectric BaTiO3 particles were investigated on the dielectric behavior of BaTiO3–Ni–polymethyl methacrylate composites fabricated by a two-step mixing and hot-molding method. The percolation power law in the smearing region was em