Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Yukio Kizaki"'
Autor:
Hideyuki Funaki, Yukio Kizaki, Mitsuyoshi Kobayashi, Yutaka Nakai, Kazuhiro Suzuki, Risako Ueno, Honam Kwon, Machiko Ito, Yuko Kizu
Publikováno v:
SID Symposium Digest of Technical Papers. 46:79-82
Two types of gradient index liquid crystal micro lens array (LC MLA) are reported for the light-field camera application. The LC MLAs enabled us to capture both of compound-eye images to be refocused on the various positions with its depth informatio
Autor:
Kazuhiro Suzuki, Honam Kwon, Yuko Kizu, Mitsuyoshi Kobayashi, Machiko Ito, Hideyuki Funaki, Risako Ueno, Yukio Kizaki
Publikováno v:
IEEE Photonics Technology Letters. 27:836-839
We have developed a microlens array (MLA) that utilizes liquid crystal (LC) for switching between light field and normal picturing modes in the camera application. The gradient index (GRIN) profile in an LC layer was obtained by applying the electric
Autor:
Shintaro Enomoto, Nobuyoshi Saito, Yukio Kizaki, Isao Amemiya, Shuichi Uchikoga, Yukitami Mizuno
Publikováno v:
SID Symposium Digest of Technical Papers. 38:1817-1820
We have developed an electrochemical reaction display (ECRD) that can be operated in dual reflective and emissive modes in an entire pixel area of a single device. The ECRD utilizes electrochromic (EC) and electrogenerated chemiluminescence (ECL) rea
Autor:
Masao Tanaka, Shintaro Enomoto, Toshiyuki Oka, Yuko Kidzu, Yutaka Nakai, Yukio Kizaki, Hitoshi Kobayashi, Aira Hotta, Katsuyuki Naito, Hiroki Iwanaga
Publikováno v:
Scopus-Elsevier
We have developed reflective liquid crystal displays using microencapsulated guest-host liquid crystals, whose size was sufficiently large for viewing documents. A high-brightness image can be realized because there is no need for polarizers. Easy fa
Publikováno v:
Electronics and Communications in Japan (Part II: Electronics). 82:11-20
By using a chip that has Au bumps and a substrate that has only a varying Al film thickness, initial bonding strength is made constant in Au–Al solid-phase diffusion bonding. On the other hand, by changing the Au–Al intermetallic compound formed
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 2:29-34
はんだ (鉛/スズ) に溶解ダメージを与えないニッケルエッチング液の設計を目的に, 三角図表示を用いて塩酸/硝酸/酢酸3成分系溶液におけるエッチング選択比の高い溶液混合比を求めた。
Publikováno v:
Electronics and Communications in Japan (Part II: Electronics). 80:9-17
Publikováno v:
Electronics and Communications in Japan (Part II: Electronics). 80:44-52
A new flip chip bonding technique using Au-Al solid phase bonding was developed. In this technique, a diffusion layer of Au and Al is formed by connecting a driver IC with Au bumps to an Al wiring board. In the conventional flip chip mounting method,
Publikováno v:
Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium.
The authors have developed a new chip-on-glass (COG) bonding technique for liquid crystal display (LCD) panels. The technique, named Au-Al solid phase diffusion flip chip bonding, was developed as follows. The gold bumps on the LSI were bonded direct
Autor:
Isao Amemiya, Kojima Tetsuya, Yuko Kizu, Ray Hasegawa, Hirofumi Wakemoto, Yukio Kizaki, Kenji Nakao, Shuichi Uchikoga
Publikováno v:
SID Symposium Digest of Technical Papers. 39:28
To improve the efficiency of bend transition in OCB, its anisotropy was analyzed. The transition antiparallel (opposite) to the rubbing direction was significantly fast and this anisotropy remained at low temperatures. We propose two effects of LC sh