Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Yukihiro Noro"'
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 12:636-642
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 12:643-650
本報では,車載電装部品において疲労信頼性が最も重要視されるチップ部品の実装プロセスが及ぼすはんだ接合部の形状への影響を調べるため,実験結果との一致性の高い鉛フリーはん
Publikováno v:
Composites Science and Technology. 68:516-525
Interlaminar fracture toughness for mode I and II deformation were investigated for carbon fiber (CF)/epoxy laminates toughened by a carbon nanofiber/epoxy interlayer. Vapor grown carbon fiber (VGCF) and vapor grown carbon nanofiber (VGNF) were chose
Publikováno v:
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
This paper presents the high reliability design method for lead-free solder joints on chip components, and that is able to evaluate effect of soldering process for solder joint shape. Coupled analysis of structure analysis and flow analysis was propo
Publikováno v:
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
The fatigue life considering dispersion of solder joints on chip resistor was investigated by experimental approach and analytical approach. The significant difference of crack propagation ratio was found each specimen by experimental approach. Howev
Publikováno v:
Proceedings of the 1992 Annual Meeting of JSME/MMD. 2003:109-110