Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Yuichi Tenya"'
Publikováno v:
Journal of Adhesion Science and Technology. 15:1039-1053
Today the microelectronics market requires devices with failure levels approaching zero. To attain this goal all production processes must be subjected to extreme quality control. Molding is one of the most critical assembly processes in power plasti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0293da5e241ee5e4830983bbcb88df26
https://doi.org/10.1163/156856101317035477
https://doi.org/10.1163/156856101317035477
Publikováno v:
Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146).
The effects of molding compound chemical formulations on some electrical failures of plastic encapsulated power MOSFETs under high temperature reverse bias testing (HTRB) have been studied. For this purpose, various molding compounds with different c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::26c27579383b6fa216a00ffeeef3f6ad
https://doi.org/10.1109/iemt.2000.910702
https://doi.org/10.1109/iemt.2000.910702
Akademický článek
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Publikováno v:
Journal of Adhesion Science & Technology. Sep2001, Vol. 15 Issue 9, p1039-1053. 15p.
Publikováno v:
Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146); 2000, p1-9, 9p
Publikováno v:
Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146); 2000, pN.PAG, 1p