Zobrazeno 1 - 10
of 23
pro vyhledávání: '"Yuichi ODA"'
Autor:
Kosaku AMANO, Yuichi ODA, Yasufumi SEKI, Kaoru YAMASHITA, Kanako BOKUDA, Atsuhiro ICHIHARA, Takakazu KAWAMATA
Publikováno v:
Neurologia Medico-Chirurgica, Vol 64, Iss 4, Pp 160-167 (2024)
Prolactin-producing pituitary tumor (PRLoma) is the most prevalent functional pituitary tumor. If the tumor becomes large, vision can be impaired. In contrast to other pituitary tumors, cabergoline (CAB) is extremely effective for PRLoma and has beco
Externí odkaz:
https://doaj.org/article/bdcdb58284744ebf9025d79830cf2b11
Autor:
Kentaro Chiba, Yasuo Aihara, Yuichi Oda, Atsushi Fukui, Shunsuke Tsuzuki, Taiichi Saito, Masayuki Nitta, Yoshihiro Muragaki, Takakazu Kawamata
Publikováno v:
Frontiers in Oncology, Vol 13 (2023)
Externí odkaz:
https://doaj.org/article/22d22c74573740f397f442229da44744
Autor:
Kentaro Chiba, Yasuo Aihara, Yuichi Oda, Atsushi Fukui, Shunsuke Tsuzuki, Taiichi Saito, Masayuki Nitta, Yoshihiro Muragaki, Takakazu Kawamata
Publikováno v:
Frontiers in Oncology, Vol 12 (2022)
Photodynamic therapy (PDT) targets tumor cell remnants after resection. Here, we evaluated the feasibility of PDT for malignant brain tumors in children and young adolescents. This was a single-center, non-randomized, phase I/II clinical study. The p
Externí odkaz:
https://doaj.org/article/2fb871f711d04e60883ffb48b6deba6e
Autor:
Takashi Komori, Kaoru Yamashita, Yuichi Oda, Kenta Masui, Kosaku Amano, Atsuhiro Ichihara, Shihori Kimura, Yasufumi Seki, Takakazu Kawamata
Publikováno v:
Endocrine journal. 69(4)
Langerhans cell histiocytosis (LCH) is a multi-organ disorder that rarely involves the hypothalamic-pituitary region (HPR). HPR-LCH presents with severe progressive pituitary dysfunction and its prognosis is poor. The definitive diagnosis of LCH is c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1a409495b2acb8cc4aef91a9ebbc54b8
https://pubmed.ncbi.nlm.nih.gov/34776469
https://pubmed.ncbi.nlm.nih.gov/34776469
Autor:
Yuichi Oda, Kosaku Amano, Yasufumi Seki, Shihori Kimura, Kaoru Yamashita, Kenta Masui, Takashi Komori, Atsuhiro Ichihara, Takakazu Kawamata
Publikováno v:
Endocrine Journal; 2022, Vol. 69 Issue 4, p441-449, 9p
Autor:
Shohei Hata, Yuichi Oda, Osamu Ikeda, Tomotake Tohei, Kazuma Kuroki, Takuto Yamaguchi, Hiromitsu Kuroda, Akio Hirose
Publikováno v:
Welding International. 31:846-856
Al-rich Zn/Al/Zn clad solder were developed as Pb-free solder for a die-attachment. The Zn/Al/Zn clad solder was produced by clad rolling of Zn and Al strips in order to prevent Al from oxidation and improve wettability. The Zn/Al/Zn clad solder was
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d3daf142c1cc28707fc5e99622abb2a9
https://doi.org/10.1080/09507116.2016.1223227
https://doi.org/10.1080/09507116.2016.1223227
Autor:
Shohei Hata, Yuichi Oda, Kazuma Kuroki, Hiromitsu Kuroda, Osamu Ikeda, Takuto Yamaguchi, Akio Hirose
Publikováno v:
Journal of Electronic Materials. 44:4769-4778
Three-layer Zn/Al/Zn clad solders have been developed for high-temperature die attachment. The clad structure is used to improve the wettability and bondability of Zn-Al eutectic solder by preventing Al oxidation. The effects of the bonding condition
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e5b722d7cb9394202b9af1fa300a21bd
https://doi.org/10.1007/s11664-015-4105-x
https://doi.org/10.1007/s11664-015-4105-x
Autor:
Shohei Hata, Takuto Yamaguchi, Hiromitsu Kuroda, Osamu Ikeda, Kazuma Kuroki, Yuichi Oda, Akio Hirose
Publikováno v:
Journal of Electronic Materials. 44:751-760
Three-layer Zn/Al/Zn clad solders have been developed for high-temperature die attachment. The clad structure is used to improve the wettability and bondability of Zn-Al eutectic solder by preventing oxidation of the Al. The materials were produced b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::854fc5bff0dbdaac5994bccb640b4fec
https://doi.org/10.1007/s11664-014-3538-y
https://doi.org/10.1007/s11664-014-3538-y
Publikováno v:
International Symposium on Microelectronics. 2013:000848-000852
Zn/Al and Zn/Al/Cu clad materials have been developed for high-temperature die attachment. The clad structure is used in an attempt to improve the wettability of Zn-Al solder by preventing oxidation of Zn and Al. The materials were produced by clad-r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4b20e8c69a7d6fc2da3f239542d4cd80
https://doi.org/10.4071/isom-2013-thp33
https://doi.org/10.4071/isom-2013-thp33
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 16:477-483
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::18f9ba4fb12efe86c53d83a5372828ea
https://doi.org/10.5104/jiep.16.477
https://doi.org/10.5104/jiep.16.477