Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Yuhua Lee"'
Publikováno v:
Journal of the Korean Physical Society. 53:943-948
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::03f01006b01b024aa8072ccf5e8b7290
https://doi.org/10.3938/jkps.53.943
https://doi.org/10.3938/jkps.53.943
Autor:
Xinfeng Zhang, Kai Zhang, Zhaoming Zeng, Lisa Liu, Guowei David Xiao, Chuiming Wan, Yuhua Lee, Cheng Sheng Ku, Matthew Ming Fai Yuen, Jie Li
Publikováno v:
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
Transparent die attach materials (DA) with moderate thermal conductivity without yellowing are preferred for mid-power LEDs, which dominate the LED backlighting and general solid-state lighting markets. A novel DA was developed based on a new kind of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::235753ace8165057a816a2bb5c3056b5
https://doi.org/10.1109/eptc.2015.7412390
https://doi.org/10.1109/eptc.2015.7412390
Autor:
Taichun Han, Yuhua Lee
Publikováno v:
Japanese Journal of Applied Physics. 43:7477-7482
Fe3C magnetic nanograins embedded in amorphous carbon thin films were synthesized by using a dc magnetron cosputtering technique. Both temperature- and field-dependent magnetization measurements were carried out for the as-deposited and annealed film
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::35261ed526415d4354745e6e9515f058
https://doi.org/10.1143/jjap.43.7477
https://doi.org/10.1143/jjap.43.7477
Autor:
Cheuk Yan Chan, Matthew Ming Fai Yuen, Kai Zhang, Zhibo Chen, Guoqi Zhang, Min Zhang, Yuhua Lee, Xinfeng Zhang, Lisa Liu, Sean Ho, Hongye Sun
Publikováno v:
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Die attach material (DA) is important to heat dissipation and light output of solid state lighting (SSL) packages. Even though high thermal conductivity benefits to reduce the bulk thermal resistance of die attach, high viscosity will increase the co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3de130be7f5779488029f76e74db085d
https://doi.org/10.1109/eurosime.2013.6529913
https://doi.org/10.1109/eurosime.2013.6529913
Autor:
Kai Zhang, Xinfeng Zhang, Zhibo Chen, Hongye Sun, Matthew Yuen, Min Zhang, Cheuk Yan Chan, Yuhua Lee, Lisa Liu, Sean Ho, Guoqi Zhang
Publikováno v:
2013 14th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems (EuroSimE); 2013, p1-7, 7p
Publikováno v:
IEEE Transactions on Magnetics. Jun2010, Vol. 46 Issue 6, p1565-1568. 4p.
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