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Publikováno v:
2010 12th Electronics Packaging Technology Conference.
The application of copper wire coated with Palladium is a solution to prevent copper oxidation during the bonding process. This is true in the Second Bond but may not be the situation when it comes to First Bond. This is because during the Free Air B
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dfb4aa9e55c86e1695da98251dc20cf9
https://doi.org/10.1109/eptc.2010.5702754
https://doi.org/10.1109/eptc.2010.5702754
Publikováno v:
2010 12th Electronics Packaging Technology Conference (EPTC); 2010, p777-782, 6p