Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Yuechen Zhuang"'
Autor:
Bin Cui, Peter Werner, Tianping Ma, Xiaoyan Zhong, Zechao Wang, James Mark Taylor, Yuechen Zhuang, Stuart S. P. Parkin
Publikováno v:
Nature Communications, Vol 9, Iss 1, Pp 1-8 (2018)
Local and reversible oxidation is used to exploit the very different properties of oxygen and vacancy ordered oxides. Here the authors directly image and make use of anisotropic migration velocities of oxygen in SrCoO x to create 3D meso-structures o
Externí odkaz:
https://doaj.org/article/17c13817fad24b92a54fd245994f0c43
Publikováno v:
ACS Nano
Intense electric fields developed during gating at the interface between an ionic liquid and an oxide layer have been shown to lead to significant structural and electronic phase transitions in the entire oxide layer. An archetypical example is the r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::094414f8702e8a715ee6e5a051ddbe43
https://hdl.handle.net/21.11116/0000-0008-7EB9-B21.11116/0000-0008-AA4B-5
https://hdl.handle.net/21.11116/0000-0008-7EB9-B21.11116/0000-0008-AA4B-5
Autor:
Zechao Wang, Stuart S. P. Parkin, Yuechen Zhuang, Xiaoyan Zhong, Tianping Ma, James M. Taylor, Bin Cui, Peter Werner
Publikováno v:
Nature Communications, Vol 9, Iss 1, Pp 1-8 (2018)
Nature Communications
Nature Communications
The controlled transformation of materials, both their structure and their physical properties, is key to many devices. Ionic liquid gating can induce the transformation of thin-film materials over long distances from the gated surface. Thus, the mec
Autor:
Fengwei Dai, Yuechen Zhuang, Daquan Yu, Guoping Zhang, Wenqi Zhang, Zhongcai Niu, Zhenzhong Yong
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
This paper studies a creative spray coating process applied to the forming of sidewall insulation of through silicon via (TSV) in CMOS image sensor (CIS) packaging. In this paper, through controlling the nitrogen gas pressure, rate of polymer solutio
Publikováno v:
2014 15th International Conference on Electronic Packaging Technology.
This paper presents a novel spray coating process for the forming of sidewall insulation of through silicon via (TSV) which was a challenging process in CMOS image sensor (CIS) packaging. In conventional way, silicon oxide by plasma enhanced chemical