Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Yue-Seon Shin"'
Publikováno v:
Surface Review and Letters. 17:201-205
SiC -mixed Sn–58Bi composite solder bumps were successfully fabricated via an electroplating process. For the composite solder bump fabrication, ultrasonically dispersed SiC nanoparticles were added to the plating solutions. DSC analysis indicated
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9d6f7a11366530989ef9fdf106ce5c37
https://doi.org/10.1142/s0218625x10013795
https://doi.org/10.1142/s0218625x10013795
Publikováno v:
Surface Review and Letters. 17(02):201-205
SiC-mixed Sn–58Bi composite solder bumps were successfully fabricated via an electroplating process. For the composite solder bump fabrication, ultrasonically dispersed SiC nanoparticles were added to the plating solutions. DSC analysis indicated t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______645::73d983bda4879095e9f011d31f187e68
http://www.worldscinet.com/cgi-bin/details.cgi?type=html&id=pii:S0218625X10013795
http://www.worldscinet.com/cgi-bin/details.cgi?type=html&id=pii:S0218625X10013795
Publikováno v:
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
Demand for high speed, high density, small size, and multifunctional electronic devices has driven the development of 3D integration. Cu pillar bumps have received great attentions in ultra fine pitch 3D packaging. In this study, Sn-3.5Ag and Sn-58Bi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::76282a07fb1ae96816ab4250afb7993b
https://doi.org/10.1109/ectc.2010.5490666
https://doi.org/10.1109/ectc.2010.5490666
Publikováno v:
2008 10th Electronics Packaging Technology Conference.
In this paper, the effect of SiC nano-particles in micro-solder bump was investigated. SiC nano-particles were dispersed by using ultrasonic homogenizer in plating solution of eutectic Sn58Bi solder and codeposited in eutectic Sn58Bi solder bumps. So
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a95bdb366f82b7403c8a80db007c6887
https://doi.org/10.1109/eptc.2008.4763448
https://doi.org/10.1109/eptc.2008.4763448
Publikováno v:
2009 European Microelectronics & Packaging Conference; 2009, p1-4, 4p
Publikováno v:
2008 10th Electronics Packaging Technology Conference; 2008, p279-284, 6p