Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Yuan-lu Xie"'
Publikováno v:
Journal of Electronics & Information Technology. 34:2247-2253
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::45c4a8349e62cc3fb2131333913b9694
https://doi.org/10.3724/sp.j.1146.2012.00048
https://doi.org/10.3724/sp.j.1146.2012.00048
Publikováno v:
Journal of Electronics (China). 29:431-444
The state-of-the-art multi-core computer systems are based on Very Large Scale three Dimensional (3D) Integrated circuits (VLSI). In order to provide high-speed vertical data transmission in such 3D systems, efficient Through-Silicon Via (TSV) techno
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c3768338ed36eb66729854a3d8a50da0
https://doi.org/10.1007/s11767-012-0861-4
https://doi.org/10.1007/s11767-012-0861-4
Publikováno v:
Journal of Electronics & Information Technology. 33:1481-1486
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c256a2559d80a914c511e13c27314e1b
https://doi.org/10.3724/sp.j.1146.2010.01114
https://doi.org/10.3724/sp.j.1146.2010.01114
Publikováno v:
VLSI-SoC
In this paper, through-silicon via (TSV) array in the form of one signal and four grounds (1S4G) are proposed to achieve high-frequency vertical connectivity for various three dimensional (3D) IC applications. Self-test method is developed to detect
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c065333f588225d08ceba47418cff916
https://doi.org/10.1109/vlsisoc.2011.6081648
https://doi.org/10.1109/vlsisoc.2011.6081648