Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Yuan-Ling Tseng"'
Autor:
Alfred A. Zinn, Randall M. Stoltenberg, Shannon M. Clark, Jerome Chang, Yuan-Ling Tseng, David A. Cullen
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
A novel nanocopper-based packaging material was developed for robust, void-free thermal interfaces between LEDs and heat sinks/spreaders. It is applicable to other high power components and devices allowing sub-10 micron thermal interfaces to enable
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::881f223a6c2e48b61411dca65268ae9b
https://doi.org/10.1109/eptc.2016.7887894
https://doi.org/10.1109/eptc.2016.7887894
Publikováno v:
2016 IEEE 16th International Conference on Nanotechnology (IEEE-NANO).
A nanocopper-based interconnect material was developed as a robust, high-performance alternative to solder. This new solder-free nanocopper material overcomes an inherent limitation of traditional solders wherein the operating temperature is limited
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::45f7e25a956585136adb964297cb7867
https://doi.org/10.1109/nano.2016.7751572
https://doi.org/10.1109/nano.2016.7751572
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 12:139-147
This paper addresses the issue of end point detection and etch time control for a reactive ion etch process. Our approach involves the use of neural networks to model the functional relationship between an end point detection signal, as well as vario
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a16663cd3627eeb0fc195be39f574678
https://doi.org/10.1109/66.744535
https://doi.org/10.1109/66.744535
Publikováno v:
1997 IEEE 6th International Conference on Emerging Technologies and Factory Automation Proceedings, EFTA '97.
We address the problem of control relevant process modeling from production data for the N-well reactive ion etching processed by LAM Rainbow Etchers. Due to physical constraints we consider building an empirical neural network model using one lot of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::19d7776149c2c0cc74c10151e9e0320a
https://doi.org/10.1109/etfa.1997.616294
https://doi.org/10.1109/etfa.1997.616294
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 16:2707
In this article we address a neural network-based end point detection scheme for reactive ion etching process. We use the etch time as the critical parameter to indicate process end point. Further, our approach involves the use of a neural network-ba
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4f55449f5c30000d07e416ea8fdbd2cf
https://doi.org/10.1116/1.590261
https://doi.org/10.1116/1.590261
Autor:
Si, J., Yuan-Ling Tseng, Clayton, M., Felker, S., Yoo, B., Martinez, J., Durham, J., Kim Dang
Publikováno v:
1997 IEEE 6th International Conference on Emerging Technologies & Factory Automation Proceedings, EFTA '97; 1997, p347-352, 6p
Autor:
Si, J., Yuan-Ling Tseng
Publikováno v:
Proceedings of the 1997 American Control Conference (Cat No97CH36041); 1997, Issue 3, p1583-1583, 1p
Conference
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Conference
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