Zobrazeno 1 - 10
of 123
pro vyhledávání: '"Yu-jin Li"'
Publikováno v:
Trials, Vol 25, Iss 1, Pp 1-9 (2024)
Abstract Background Direct high-quality evidence remains absent on the benefits of HBeAg-negative chronic hepatitis B patients (CHB) with normal alanine transaminase (ALT) and positive HBV DNA after nucleos(t)ide analogs (NAs) treatment. Methods This
Externí odkaz:
https://doaj.org/article/b0e70190a0aa4068b3cec3936707abd6
Publikováno v:
Journal of Materials Research and Technology, Vol 14, Iss , Pp 719-730 (2021)
In 3D IC integration, a critical demand of interfacial joints in high-end devices is ultra-fine pitch, below 2 μm. The pitch cannot be fabricated by using solder joints because of its low melting point. Microelectronic industry prefers a solid state
Externí odkaz:
https://doaj.org/article/68c4d8f23895405b8a30681c221ffe39
Publikováno v:
Results in Chemistry, Vol 4, Iss , Pp 100257- (2022)
The fluorescence coumarin derivatives were synthesised by an efficient one-pot, three-component reaction in 80–90% yields. The optical properties of these coumarin derivatives (4a-4d), such as the influence of different solvent to the fluorescence
Externí odkaz:
https://doaj.org/article/5e778b2257324118acc76c9038ce0fa9
Publikováno v:
Cellular Physiology and Biochemistry, Vol 51, Iss 5, Pp 2275-2289 (2018)
Background/Aims: Parkinson’s disease (PD) is a frequently occurring condition that resulted from the loss of midbrain neurons, which synthesize the neurotransmitter dopamine. In this study, we established mouse models of PD to investigate the expre
Externí odkaz:
https://doaj.org/article/5c06e5b30d2f4bc5bdea24d494571d6b
Publikováno v:
Materials, Vol 14, Iss 21, p 6394 (2021)
In microelectronic packaging technology for three-dimensional integrated circuits (3D ICs), Cu-to-Cu direct bonding appears to be the solution to solve the problems of Joule heating and electromigration (EM) in solder microbumps under 10 μm in diame
Externí odkaz:
https://doaj.org/article/001536b276f041919c682d97487e8dc0
Publikováno v:
Materials, Vol 14, Iss 19, p 5522 (2021)
The failure mechanisms of Cu–Cu bumps under thermal cycling test (TCT) were investigated. The resistance change of Cu–Cu bumps in chip corners was less than 20% after 1000 thermal cycles. Many cracks were found at the center of the bonding interf
Externí odkaz:
https://doaj.org/article/ec18d82ee1064d099973cfabf1109681
Publikováno v:
Materials, Vol 13, Iss 5, p 1211 (2020)
Tensile tests on two kinds of electroplated copper foils with twins before and after annealing were performed. One electroplating parameter results in a microstructure of -oriented microtwinned Cu (mt-Cu), and the other is -oriented nanotwinned Cu (n
Externí odkaz:
https://doaj.org/article/ac7d9a3265554bcfb7ec81405061d7ea
Publikováno v:
Materials, Vol 13, Iss 6, p 1310 (2020)
We performed tensile tests on highly -oriented nanotwinned copper (nt-Cu) foils with different columnar grain structures. For a systematic study, we altered the microstructure of the foils by tuning the electroplating electrolyte and annealing temper
Externí odkaz:
https://doaj.org/article/7691007778b04e25bbab69e1d352b5ff
Autor:
De-Wei Zhao, Mang Yu, Kai Hu, Wei Wang, Lei Yang, Ben-Jie Wang, Xiao-Hong Gao, Yong-Ming Guo, Yong-Qing Xu, Yu-Shan Wei, Si-Miao Tian, Fan Yang, Nan Wang, Shi-Bo Huang, Hui Xie, Xiao-Wei Wei, Hai-Shen Jiang, Yu-Qiang Zang, Jun Ai, Yuan-Liang Chen, Guang-Hua Lei, Yu-Jin Li, Geng Tian, Zong-Sheng Li, Yong Cao, Li Ma
Publikováno v:
Chinese Medical Journal, Vol 128, Iss 21, Pp 2843-2850 (2015)
Background: Nontraumatic osteonecrosis of the femoral head (NONFH) is a debilitating disease that represents a significant financial burden for both individuals and healthcare systems. Despite its significance, however, its prevalence in the Chinese
Externí odkaz:
https://doaj.org/article/e7247387070846c9aabdb212ed181249
Publikováno v:
Materials, Vol 11, Iss 12, p 2368 (2018)
Highly (111)-oriented Cu pillar-bumps were bonded to highly (111)-oriented Cu films at temperatures ranging from 200 °C/100 °C to 350 °C/100 °C in N2 ambient conditions. The microstructures of the bonded interfaces affected the shear strength per
Externí odkaz:
https://doaj.org/article/323747d401b044098dd05e1dfc8db45b