Zobrazeno 1 - 10
of 21
pro vyhledávání: '"Yu-Min Tsai"'
Autor:
Yu-Min Tsai, 蔡育旻
101
Advertising plays an important role in marketing history. The global creative and marketing awards still value advertising creativity as treasure every year. In practice, consumers nowadays could get more information of interesting consumpti
Advertising plays an important role in marketing history. The global creative and marketing awards still value advertising creativity as treasure every year. In practice, consumers nowadays could get more information of interesting consumpti
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/75341443723208487538
Autor:
Yu-Min Tsai, 蔡祐民
100
This study is to investigate the plasma thermal spray coating (Co-Mo-Cr-Si) on base metal of titanium alloy (Ti-6Al-4V) for the analysis of mechanism bonding properties. This research used the Taguchi methods to identify the significant para
This study is to investigate the plasma thermal spray coating (Co-Mo-Cr-Si) on base metal of titanium alloy (Ti-6Al-4V) for the analysis of mechanism bonding properties. This research used the Taguchi methods to identify the significant para
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/39587715080090952570
Autor:
Yu-Min Tsai, 蔡玉敏
98
This study focuses on eight commonly used Umbelliferae natural medicines which have anti-inflammatory and analgesic effects for our health in daily life,including Angelica dahurica(Fisch.ex Hoffm.) Benth.et Hook.f.、Ligusticum chuanxiong Hor
This study focuses on eight commonly used Umbelliferae natural medicines which have anti-inflammatory and analgesic effects for our health in daily life,including Angelica dahurica(Fisch.ex Hoffm.) Benth.et Hook.f.、Ligusticum chuanxiong Hor
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/38558238227604820922
Autor:
Yu-Min Tsai, 蔡育珉
95
No matter it’s a developed or developing country, new type of social structure is due to fast growth of aging population, because the reduction of fertility, shrinkage of young population, countries around the world are facing the tendency
No matter it’s a developed or developing country, new type of social structure is due to fast growth of aging population, because the reduction of fertility, shrinkage of young population, countries around the world are facing the tendency
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/92127863435519967225
Autor:
Yu-Min Tsai, 蔡裕民
94
ABTRACT In this study we use Indium-Tin Oxide (ITO) to deposit films on flexible substrate as the conductive electrode used for flexible display. Besides we produced MIM capacitance and measured electrical properties to improve the character
ABTRACT In this study we use Indium-Tin Oxide (ITO) to deposit films on flexible substrate as the conductive electrode used for flexible display. Besides we produced MIM capacitance and measured electrical properties to improve the character
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/62419066658737567618
Autor:
Yu-min Tsai, 蔡瑜明
91
Wire Bonder and Molding are the most costive equipments in the investment of IC packaging; and the packaging quality, cost and delivery are concerned most in the assembly processes. An inappropriate process scheduling may result in the wastes
Wire Bonder and Molding are the most costive equipments in the investment of IC packaging; and the packaging quality, cost and delivery are concerned most in the assembly processes. An inappropriate process scheduling may result in the wastes
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/14922886290001568086
Interconnect Reliability Characterization of a High-Density 3-D Chip-on-Chip Interconnect Technology
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 3:2037-2047
This paper investigates the solder interconnect reliability of a high-density 3-D chip-on-chip technology under an accelerated thermal cycling (ATC) test condition through finite element (FE) modeling and experimental validation. The fabrication of t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9eacb4a113e2d5c76ea255326a22a39b
https://doi.org/10.1109/tcpmt.2013.2277735
https://doi.org/10.1109/tcpmt.2013.2277735
Publikováno v:
Microelectronics Reliability. 53:30-40
The study aims at assessing the growth reaction of the Ni3Sn4 intermetallic compound (IMC) during bonding process and its dependences on the thermal-cycling reliability of the Cu/Ni/SnAg micro-joints of an advanced 3D chip stacking package under acce
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::459f7cd0976c37f458bbc037b1bf9f62
https://doi.org/10.1016/j.microrel.2012.06.146
https://doi.org/10.1016/j.microrel.2012.06.146
Publikováno v:
Inorganic Chemistry. 38:4183-4187
Two novel piperazinium vanadyl(IV) compounds, (C4H12N2)[VO(C2O4)HAsO4] (1) and (C4H12N2)[VO(C2O4)HPO4] (2), have been prepared under mild hydrothermal conditions and structurally characterized by single-crystal X-ray diffraction, thermogravimetric an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fcc5bc0f566603375bbf8ef590a9a051
https://doi.org/10.1021/ic990501p
https://doi.org/10.1021/ic990501p