Zobrazeno 1 - 1
of 1
pro vyhledávání: '"Yu-Jyun Kao"'
Publikováno v:
Scientific Reports, Vol 13, Iss 1, Pp 1-8 (2023)
Abstract Electroplated Cu has been extensively applied in advanced electronic packaging, and its mechanical properties are critical for reliability. In this study, Cu foils fabricated through electroplating with various bis-(3-sulfopropyl) disulfide
Externí odkaz:
https://doaj.org/article/070f50f3c8fd4f6d8cde09d2a32e0b98