Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Yu-Guan Lee"'
Autor:
Leonid L. Rusevich, Eugene A. Kotomin, Guntars Zvejnieks, Marjeta Maček Kržmanc, Suraj Gupta, Nina Daneu, Jeffrey C.S. Wu, Yu-Guan Lee, Wen-Yueh Yu
Publikováno v:
The Journal of Physical Chemistry C. 126:21223-21233
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::287dc5ec4e577a96ab064d134a6a995c
https://doi.org/10.1021/acs.jpcc.2c05993
https://doi.org/10.1021/acs.jpcc.2c05993
Autor:
Yu-Guan Lee, Yu-Ching Cheng, Yu-Tang Lin, Jeffrey C. S. Wu, Wen-Yueh Yu, Marjeta Maček Kržmanc, Suraj Gupta, Eugene Kotomin
Publikováno v:
The Journal of Physical Chemistry C.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::24a0bb6ef7a60a7b43e713b32244fccd
https://doi.org/10.1021/acs.jpcc.3c00483
https://doi.org/10.1021/acs.jpcc.3c00483
Autor:
Yu-Guan Lee, Wei-Ping Dow
Publikováno v:
ECS Meeting Abstracts. :1257-1257
In the traditional circuit board metallization process, the electroless plating process is the most common, but it contains precious metals (such as palladium catalyst), formaldehyde and chelating agents which can cause a serious environmental proble
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f47f9649ec25d5ac8208a79e773636a3
https://doi.org/10.1149/ma2019-02/28/1257
https://doi.org/10.1149/ma2019-02/28/1257