Zobrazeno 1 - 10
of 28
pro vyhledávání: '"Yu-Chun Liang"'
Publikováno v:
Healthcare, Vol 10, Iss 3, p 534 (2022)
Understanding the factors that influence cigarette smoking among adolescents is critical. We identified personal, community, and environmental factors associated with current cigarette smoking among adolescents. This population-based cross-sectional
Externí odkaz:
https://doaj.org/article/04509bffb2264965a350c8bfe0b5631f
Autor:
Yuan-Wei Chang, Chia-chia Hu, Hsin-Ying Peng, Yu-Chun Liang, Chih Chen, Tao-chih Chang, Chau-Jie Zhan, Jing-Ye Juang
Publikováno v:
Scientific Reports, Vol 8, Iss 1, Pp 1-10 (2018)
Abstract Microbumps in three-dimensional integrated circuit now becomes essential technology to reach higher packaging density. However, the small volume of microbumps dramatically changes the characteristics from the flip-chip (FC) solder joints. Fo
Externí odkaz:
https://doaj.org/article/95d9bab85d2d47cb8eb43dd4186fb7ff
Autor:
Yu-Chun Liang, 梁瑜君
102
Title of Thesis: A study on the adjusting between mother-in-law and daughter-in-law of highly-educated married women. Name of Institute:Graduate Instiute of Adult and Continuing Education,College of Education,National Chi Nan University Page
Title of Thesis: A study on the adjusting between mother-in-law and daughter-in-law of highly-educated married women. Name of Institute:Graduate Instiute of Adult and Continuing Education,College of Education,National Chi Nan University Page
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/22343597205981466808
Publikováno v:
npj 2D Materials and Applications, Vol 4, Iss 1, Pp 1-9 (2020)
Due to the population explosion of the 21st century, nearly one billion people are over 64 years of age and bone fracture is one of the most frequent problems facing both sexes because of osteoporosis. However, difficulty in enhancing bone regenerati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f5774080da957a4654423c69449b3b44
https://doi.org/10.1038/s41699-020-00168-y
https://doi.org/10.1038/s41699-020-00168-y
Publikováno v:
International Journal of Space Structures. 29:61-70
Many truss structures have been destroyed and collapsed one by one all over the world due to overloaded snow and wind load, etc. To investigate the mechanical property of truss structures, OpenSees package is utilized to evaluate reliability and sens
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::32ec5ee2ce950a3a67882454bdeb2fc8
https://doi.org/10.1260/0266-3511.29.2.61
https://doi.org/10.1260/0266-3511.29.2.61
Autor:
Yu-Chun Liang, Chih Chen
Publikováno v:
2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
The microstructure evolution in the sandwich structure of Ni/Sn2.3Ag/Ni microbumps with 4 μm and 12 μm in solder thickness during reflowing process at 260 °C was revealed in this study. When the microbumps with 4 μm in solder thickness were subje
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::24d97a04920fe313d71bc68533f695eb
https://doi.org/10.1109/impact.2011.6117245
https://doi.org/10.1109/impact.2011.6117245
Autor:
Chih Chen, T. C. Chang, Yuan Wei Chang, Hsin-Ying Peng, Jin-Ye Juang, Yu-Chun Liang, Chau-Jie Zhan
Publikováno v:
2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.
The ultra fine pitch micro bump became the future trend due to the development of 3D IC. In this research, three-dimensional simulation was employed to examine the temperature distribution in micro SnAg solder bumps. According to the result, the temp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::85da3c30ae50d4275dc3e892ee663f90
https://doi.org/10.1109/impact.2010.5699603
https://doi.org/10.1109/impact.2010.5699603
Publikováno v:
2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.
Recently, the dimensions of the flip-chip solder bumps reduce to about 20–30 micrometers, also known as "micro-bumps" sandwitched between two Si chips. In such a structure, electromigration and thermomigration behaviors in the micro-bumps are not c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d09aa5215dcc2ea29ce87078805d5cab
https://doi.org/10.1109/impact.2010.5699600
https://doi.org/10.1109/impact.2010.5699600
Publikováno v:
MRS Proceedings. 1249
In this study, the temperature map distribution in the Sn3.0Ag0.5Cu solder bump with Cu column under current stressing is directly examined using infrared microscopy. It is the radiance changes between the different materials of the surface that caus
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::02ad82b1df4ce6995ea8455e78f38c08
https://doi.org/10.1557/proc-1249-f08-02
https://doi.org/10.1557/proc-1249-f08-02
Publikováno v:
Cellular signalling. 18(11)
Expression of nucleophosmin/B23 and E2F1 and E2F1-dependent transcription increased in U1 bladder cancer cells upon serum stimulation from quiescence. Nucleophosmin/B23-siRNA treatment abrogated such increase of E2F1-dependent transcriptional activit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5170465fb730a6a7b8f2a546a0144de8
https://pubmed.ncbi.nlm.nih.gov/16725311
https://pubmed.ncbi.nlm.nih.gov/16725311