Zobrazeno 1 - 10
of 58
pro vyhledávání: '"Yu-Chou Shih"'
Publikováno v:
Nanomaterials, Vol 11, Iss 8, p 1901 (2021)
The potential of an innovation for establishing a simultaneous mechanical, thermal, and electrical connection between two metallic surfaces without requiring a prior time-consuming and expensive surface nanoscopic planarization and without requiring
Externí odkaz:
https://doaj.org/article/49e065ad62f14957b04bf90826a5d5eb
Publikováno v:
Nanomaterials, Vol 11, Iss 6, p 1589 (2021)
The growing demand for increased chip performance and stable reliability calls for the development of novel off-chip interconnection and bonding methods that can process good electrical, thermal, and mechanical performance simultaneously as well as s
Externí odkaz:
https://doaj.org/article/205d0260fead40d6978b02ad71b352fd
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 21:424-430
A packaging approach for cost-effective and ultrathin high-power phosphor-based white light-emitting-diode (WLED) emitters with outstanding reliability is presented. By removing the encapsulant in the conventional method, the new approach employs a s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8c63e67ec953a177b4f140eef51e459f
https://doi.org/10.1109/tdmr.2021.3104767
https://doi.org/10.1109/tdmr.2021.3104767
Publikováno v:
Nanomaterials, Vol 11, Iss 1589, p 1589 (2021)
Nanomaterials
Volume 11
Issue 6
Nanomaterials
Volume 11
Issue 6
The growing demand for increased chip performance and stable reliability calls for the development of novel off-chip interconnection and bonding methods that can process good electrical, thermal, and mechanical performance simultaneously as well as s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c6f5d529d8219682334470703795d1da
https://pubmed.ncbi.nlm.nih.gov/34204330
https://pubmed.ncbi.nlm.nih.gov/34204330
Publikováno v:
Nanomaterials
Nanomaterials, Vol 11, Iss 1901, p 1901 (2021)
Volume 11
Issue 8
Nanomaterials, Vol 11, Iss 1901, p 1901 (2021)
Volume 11
Issue 8
The potential of an innovation for establishing a simultaneous mechanical, thermal, and electrical connection between two metallic surfaces without requiring a prior time-consuming and expensive surface nanoscopic planarization and without requiring
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0d3c476b889a5d1ce6e3d43c1a8c1434
https://doi.org/10.3390/nano11081901
https://doi.org/10.3390/nano11081901
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 7:1453-1458
Effectiveness of polymer composite-induced passive radiation cooling in thermal management of LED emitters and modules is elucidated by numerical simulations coupled with key experimental observations. Specifically, various polymer-filler composites
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b475f6571e893c729f6979b3196f0f24
https://doi.org/10.1109/tcpmt.2017.2703826
https://doi.org/10.1109/tcpmt.2017.2703826
Autor:
Yu-Chou Shih, Frank G. Shi
Publikováno v:
IEEE Journal of Selected Topics in Quantum Electronics. 23:1-4
The feasibility of quantum dot (QD)-based silicone composites as suitable candidates, in terms of down conversion efficiency, for the replacement or the enhancement of color filters in high-brightness liquid crystal displays is investigated for the f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::666e6e42599715e673f9599f39a10508
https://doi.org/10.1109/jstqe.2017.2748923
https://doi.org/10.1109/jstqe.2017.2748923
Publikováno v:
IEEE Journal of Selected Topics in Quantum Electronics. 23:1-4
The design of the quantum dot (QD) color conversion film in the liquid crystal display (LCD) backlighting is optimized in terms of reducing the required amount of relatively expensive QD materials. It is demonstrated for the first time that a dichroi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::db8dd3a09d829bdc0e159993b7517e03
https://doi.org/10.1109/jstqe.2017.2677898
https://doi.org/10.1109/jstqe.2017.2677898
Publikováno v:
Materials Science in Semiconductor Processing. 56:155-159
Die bonding is the first step in the packaging of light-emitting diodes and its role in lumen output performance and consistency of the packaged LED emitters has recently been investigated: there is an optimal range of bond-line thickness (BLT) and t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1175863d3ad77d6b4691014de95d71a6
https://doi.org/10.1016/j.mssp.2016.08.010
https://doi.org/10.1016/j.mssp.2016.08.010
Publikováno v:
International Symposium on Microelectronics. 2016:000196-000201
The role of die attach adhesive in influencing light output of the white chip-on-board (COB) light emitting diode (LED) emitters is investigated using Monte-Carlo simulations. It is demonstrated for the first time that the use of an optically clear a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bdd301bf8ee995aca0fbfd50530992c4
https://doi.org/10.4071/isom-2016-wa41
https://doi.org/10.4071/isom-2016-wa41