Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Yu-Chieh Teng"'
Autor:
Yu-Chieh Teng, 鄧宇傑
98
The present research aims to quantify the highway runoff pollution. The research site was placed at the section of Zhongxiao to Chang’an in Jianguo viaduct (Site A) and the roadway front of the Ping-Lin Expressway Management Station (Site B
The present research aims to quantify the highway runoff pollution. The research site was placed at the section of Zhongxiao to Chang’an in Jianguo viaduct (Site A) and the roadway front of the Ping-Lin Expressway Management Station (Site B
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/h6532q
Publikováno v:
IEEE Internet of Things Journal. 9:24466-24476
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d2e60fcabe6e7f3c9bfe4b46ad7ffe96
https://doi.org/10.1109/jiot.2022.3190619
https://doi.org/10.1109/jiot.2022.3190619
Autor:
Yu-Chieh Teng, 鄧羽傑
104
The purpose of this work is to study the application of supercritical CO2 electroplating, post supercritical CO2 electroplating and traditional electroplating processes to fabricate Cu metal thin films, and discuss the effects of adjusting t
The purpose of this work is to study the application of supercritical CO2 electroplating, post supercritical CO2 electroplating and traditional electroplating processes to fabricate Cu metal thin films, and discuss the effects of adjusting t
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/pmkk32
Publikováno v:
Materials Science in Semiconductor Processing. 56:5-13
Supercritical CO2 (sc-CO2), post sc-CO2 and traditional electroplating are used to fabricate Cu metal thin films. The effects of adjusting electroplating pressure over grain size, preferred grain orientation, mechanical properties and sheet resistanc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9c93922d152e2126f0e97cc13991284f
https://doi.org/10.1016/j.mssp.2016.07.016
https://doi.org/10.1016/j.mssp.2016.07.016
Autor:
Kuo, Han-Pin, Yu, Chieh-Teng
Publikováno v:
Chest; December 1993, Vol. 104 Issue: 6 p1773-1778, 6p