Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Yu HARUBEPPU"'
Publikováno v:
Nihon Kikai Gakkai ronbunshu, Vol 86, Iss 883, Pp 19-00330-19-00330 (2020)
Various bonding materials have been developed for power semiconductor products. However, the fatigue characteristics of many of these materials are difficult to evaluate uniformly using a conventional test, and this difficulty represents an obstacle
Externí odkaz:
https://doaj.org/article/7c46568ce2e6458b8f9fc65d6c0908b5
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 22:112-118
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6d824cd77105bc8ed4694e82cb526146
https://doi.org/10.5104/jiep.22.112
https://doi.org/10.5104/jiep.22.112
Autor:
Takaaki Miyazaki, Toshiaki Morita, Daisuke Kawase, Yu Harubeppu, Koji Sasaki, Osamu Ikeda, Hisashi Tanie
Publikováno v:
The Proceedings of the Materials and Mechanics Conference. 2019:OS0312
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bf0d7662dca8586e289bfdac901b3d61
https://doi.org/10.1299/jsmemm.2019.os0312
https://doi.org/10.1299/jsmemm.2019.os0312
Publikováno v:
The Proceedings of the Materials and processing conference. :223
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::68fe108e015dd84ef8cc5d7829f15c38
https://doi.org/10.1299/jsmemp.2019.27.223
https://doi.org/10.1299/jsmemp.2019.27.223
Autor:
Masaru Fujiyoshi, Yu Harubeppu, Hisashi Tanie, Hiroshi Shintani, Nobuhiko Chiwata, Shinichi Fujiwara
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 15:541-549
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f732664c86e5e942b4fcb084173c05f6
https://doi.org/10.5104/jiep.15.541
https://doi.org/10.5104/jiep.15.541
Publikováno v:
The Proceedings of Mechanical Engineering Congress, Japan. 2018:J0470105
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ca765de73a8c5c426b20dde8a6fc4a0e
https://doi.org/10.1299/jsmemecj.2018.j0470105
https://doi.org/10.1299/jsmemecj.2018.j0470105
Publikováno v:
The Proceedings of Ibaraki District Conference. :109-110
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b5d44a2835b54cf33c7ca423858cfad8
https://doi.org/10.1299/jsmeibaraki.2015.23.109
https://doi.org/10.1299/jsmeibaraki.2015.23.109
Autor:
Masaru Fujiyoshi, Hisashi Tanie, Shinichi Fujiwara, Hiroshi Shintani, Nobuhiko Chiwata, Yu Harubeppu
Publikováno v:
2012 4th Electronic System-Integration Technology Conference.
Electromigration (EM) failures of flip-chip solder joints due to void growth, resulting from miniaturization of joint structure, have recently been reported. In addition, growth behavior of electromigration voids in solder joints has not been clarifi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3b5f12194b089a25b1252adedc4c1e51
https://doi.org/10.1109/estc.2012.6542076
https://doi.org/10.1109/estc.2012.6542076
Publikováno v:
The Proceedings of the Materials and processing conference. :625-1
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2e303e87ca66e38617f2d60e44e0ad68
https://doi.org/10.1299/jsmemp.2015.23._625-1_
https://doi.org/10.1299/jsmemp.2015.23._625-1_
Autor:
Shinichi Fujiwara, Yu Harubeppu, Hisashi Tanie, Masaru Fujiyoshi, Nobuhiko Chiwata, Hiroshi Shintani
Publikováno v:
The Proceedings of Ibaraki District Conference. :41-42
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::14acfc97b60bd7ed61a079dc97ef7bbd
https://doi.org/10.1299/jsmeibaraki.2012.20.41
https://doi.org/10.1299/jsmeibaraki.2012.20.41