Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Youssef Maniar"'
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d75468f597cf8b3d915b87b92019d4ea
https://doi.org/10.1109/eurosime56861.2023.10100794
https://doi.org/10.1109/eurosime56861.2023.10100794
Publikováno v:
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b49948b5f47a1a07a2dbbd49427f7e98
https://doi.org/10.1109/eurosime54907.2022.9758920
https://doi.org/10.1109/eurosime54907.2022.9758920
Publikováno v:
Microelectronics Reliability. 139:114751
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a211b05dee2596a8d064a39dd9c2c426
https://doi.org/10.1016/j.microrel.2022.114751
https://doi.org/10.1016/j.microrel.2022.114751
Autor:
Siegfried Schmauder, Peter Binkele, Youssef Maniar, A. Kabakchiev, Marta Kuczynska, Masoomeh Bazrafshan
Publikováno v:
ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
The increasing electrified mobility poses a challenge on reliability prediction of automotive electronics, especially when safety systems are concerned. The use of finite element simulation for accurate end-of-life prediction of automotive electronic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1a8c2dc15b13348e8f878db0380c3997
https://doi.org/10.1115/ipack2021-73100
https://doi.org/10.1115/ipack2021-73100
Publikováno v:
ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
The reoccurring cyclic load imposed onto soldered electronic components during their operation time leads to accumulation of inelastic strains in the structure. On a microscale level, the degree of plastic deformation is determined by the formation a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::98ca882161a9e546ca08d98602c74487
https://doi.org/10.1115/ipack2021-73319
https://doi.org/10.1115/ipack2021-73319
Publikováno v:
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
The cost and time efficient qualification process of solder joints’ reliability in automotive electronic assemblies requires accelerated temperature cycling (ATC) testing. This work introduces a load-dependent reliability assessment method on board
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9dca8c8896f32c8b8c5b980656166efe
https://doi.org/10.1109/eurosime52062.2021.9410829
https://doi.org/10.1109/eurosime52062.2021.9410829
Publikováno v:
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
The cost- and time-efficient qualification process of solder joints in automotive electronic assemblies requires accelerated temperature cycling (ATC) testing. Such tests, aiming to investigate durability of solder joints in increased temperature ran
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b19156f5ecb55364385b2ab17733e93b
https://doi.org/10.1109/eurosime48426.2020.9152198
https://doi.org/10.1109/eurosime48426.2020.9152198
Publikováno v:
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
In the first part of this paper difference between simulated SN-Curves under shearing and tensile cyclic load are presented and compared with measurement performed by A. Desphante and A. Dasgupta [1–2]. The two load modes are simulated until a spec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::57ea36db1461b84e50d6110ee8a4abd4
https://doi.org/10.1109/eurosime.2019.8724512
https://doi.org/10.1109/eurosime.2019.8724512
Autor:
Felix Wagner, Stefan Kaessner, Bernhard Wunderle, Martin Rittner, Lukas Lang, Michael Guyenot, Youssef Maniar
Publikováno v:
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
The need for small, high efficient (98%) and high temperature capable $(200^{\circ}{\rm{C}})$ power electronics lead to the development of SiC-power modules, which can satisfy these advanced requirements. Power electronics have often to resist harsh
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c02ced409119eaf2256dcd47f664fbc7
https://doi.org/10.1109/eurosime.2019.8724587
https://doi.org/10.1109/eurosime.2019.8724587
Publikováno v:
Microelectronics Reliability. 120:114101
In the first part of this paper the differences between simulated SN-Curves under shearing and tensile cyclic loads are presented and compared with measurements published by A. Deshpande and A. Dasgupta [1, 2]. The measurements under the two load mod
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bf17c65a57b28325a744c8e160e9cd0f
https://doi.org/10.1016/j.microrel.2021.114101
https://doi.org/10.1016/j.microrel.2021.114101