Zobrazeno 1 - 10
of 23
pro vyhledávání: '"Youssef Drissi"'
Autor:
Syed Muhammad Yasser Sherazi, Yihan Chang, Youssef Drissi, Bilal Chehab, Jae Uk Lee, Victor Vega Gonzalez, Ryan Ryoung Han Kim
Publikováno v:
DTCO and Computational Patterning.
Autor:
Youssef Drissi, Werner Gillijns, Sebastien Lardenois, Peter Verheyen, Guy Lepage, Mahmoud Mohsen, Maxence Delorme
Publikováno v:
Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XV.
Publikováno v:
Proceedings of the Annual Hawaii International Conference on System Sciences.
Publikováno v:
Design-Process-Technology Co-optimization XV.
EUV single patterning opportunity for pitch 28nm metal design is explored. Bright field mask combined with a negative tone develop process is used to improve pattern fidelity and overall process window. imec N3 (Foundry N2 equivalent) logic PNR (plac
Autor:
Youssef Drissi, Amit Dounde, Syed Muhammad Yasser Sherazi, Werner Gillijns, Ryoung-han Kim, Darko Trivkovic
Publikováno v:
Photomask Technology 2019.
With the advent of Multi-beam mask writers, curvilinear shapes are being realized with comparable metrics to Manhattan shapes when it comes to write times which has been the main issue with conventional VSB mask writers. Techniques like PLDC also enh
Publikováno v:
Extreme Ultraviolet (EUV) Lithography X.
Advanced technology nodes are demanding aggressive printability using EUV. EUV printing process inherently brings in stochastic defects. To measure and experience various types of Stochastics in EUV printing, high volume measurements are deemed neces
Autor:
Ryan Ryoung Han Kim, James Word, Werner Gillijns, Jae Uk Lee, Ahmed Hamed-Fatehy, Rehab Kotb, Rajiv Naresh Sejpal, Youssef Drissi, Germain Fenger
Publikováno v:
Design-Process-Technology Co-optimization for Manufacturability XIII
In this work we are introducing a manufacturing flow for the SALELE Process in details. Starting with layout decomposition, where the drawn layer is decomposed into 4 Masks: 2 Metal-like Masks, and 2 Block-like Masks. Then each of these masks is subj
Autor:
Joost Bekaert, Guido Schiffelers, G. McIntyre, Michiel Kupers, E. De Poortere, Werner Gillijns, Ming Mao, Mircea Dusa, Eric Hendrickx, Jörn-Holger Franke, V. M. Blanco Carballo, J. Jia, Ling Ee Tan, M. Demand, R. H. Kim, K. Nafus, Stephen Hsu, David Rio, S. Biesemans, Youssef Drissi
Publikováno v:
Extreme Ultraviolet (EUV) Lithography IX.
This paper summarizes findings for an N5 equivalent M2 (pitch 32) layer patterned by means of SE EUV. Different mask tonalities and resist tonalities have been explored and a full patterning (litho plus etch) process into a BEOL stack has been develo
Autor:
Victor M. Blanco Carballo, Rudi De Ruyter, Kurt G. Ronse, Stephane Lariviere, Youssef Drissi, Werner Gillijns, Darko Trivkovic, G. McIntyre, Ryoung-han Kim, Jae Uk Lee, Patrick P. Naulleau, Ling Ee Tan, Morin Dehan, Toshiro Itani, Paolo A. Gargini
Publikováno v:
International Conference on Extreme Ultraviolet Lithography 2017.
imec’s investigation on EUV single patterning insertion into industry 5nm-relevant logic metal layer is discussed. Achievement and challenge across imaging, OPC, mask data preparation and resulting wafer pattern fidelity are reported with a broad s
Autor:
Victor Blanco, Greg McIntyre, Ling Ee Tan, Joost Bekaert, Praveen Raghavan, Ryoung-han Kim, Darko Trivkovic, Peter Debacker, Youssef Drissi, J. Ryckaert, Ming Mao, Stephane Lariviere, Yasser Sherazi, Werner Gillijns
Publikováno v:
SPIE Proceedings.
imec’s DTCO and EUV achievement toward imec 7nm (iN7) technology node which is industry 5nm node equivalent is reported with a focus on cost and scaling. Patterning-aware design methodology supports both iArF multiple patterning and EUV under one c