Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Yousef Safari"'
Autor:
Yousef Safari, Boris Vaisband
Publikováno v:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 31:287-295
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::586d6fbd7f98ba0e6b4f43c7cbf62a24
https://doi.org/10.1109/tvlsi.2022.3214793
https://doi.org/10.1109/tvlsi.2022.3214793
Autor:
Yousef Safari, Boris Vaisband
Publikováno v:
Wiley Encyclopedia of Electrical and Electronics Engineering. :1-10
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e99471667381901062fbe27552743bf5
https://doi.org/10.1002/047134608x.w8433
https://doi.org/10.1002/047134608x.w8433
Publikováno v:
Journal of Intelligent Material Systems and Structures. 33:2074-2085
Aquatic environments and water resources face a variety of risks from numerous sources of pollution. In this paper, we propose a preliminary mechanism for realizing robotic technology practically and cost-effectively for monitoring these pollutions.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fa99123ee77985cac650ba2e45eec599
https://doi.org/10.1177/1045389x211072522
https://doi.org/10.1177/1045389x211072522
Split-Fabric: A Novel Wafer-Scale Hardware Obfuscation Methodology using Silicon Interconnect Fabric
Autor:
Yousef Safari, Yu-Tao Yang, Subramanian S. Iyer, Toshifumi Nakatani, Neal Levine, Boris Vaisband
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::49472a7a90d4f56036181ba273381673
https://doi.org/10.1109/ectc51906.2022.00111
https://doi.org/10.1109/ectc51906.2022.00111
Autor:
Yousef Safari, Boris Vaisband
Publikováno v:
2022 23rd International Symposium on Quality Electronic Design (ISQED).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::458d4bb50821731eb8ba74ea9b225e0a
https://doi.org/10.1109/isqed54688.2022.9806286
https://doi.org/10.1109/isqed54688.2022.9806286
Autor:
Boris Vaisband, Yousef Safari
Publikováno v:
ISCAS
Silicon interconnect fabric (Si-IF) is a wafer-scale heterogeneous integration platform. This platform promotes a paradigm shift in system integration and packaging methods, providing a single hierarchy of integration between the dies and the platfor
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a02942c5677eed52b449cf98c4183252
https://doi.org/10.1109/iscas51556.2021.9401673
https://doi.org/10.1109/iscas51556.2021.9401673