Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Youngsuk Hwang"'
Autor:
Sung-min Sim, Yeonsu Lee, Hye-Lim Kang, Youngsuk Hwang, Chi-Hyun Park, Ignacio Llamas-Garro, Jung-Mu Kim
Publikováno v:
Micro and Nano Systems Letters, Vol 6, Iss 1, Pp 1-6 (2018)
Abstract In this paper, a stress and fracture study, occurring during the chemical mechanical polishing (CMP) of anodically bonded substrates is presented. The samples contain glass pillars, used to form the glass cavities and a silicon substrate sea
Externí odkaz:
https://doaj.org/article/074b0d2080ea4bdf8378ed2925983c64
Autor:
Younghee Oh, Silbee Yang, Eunji Kim, Mok-Young Lee, Yeosook Kim, Jung-Hun Kim, Hyelim Cho, Donggyu Kim, Su Jeong Choi, Somi Park, Jiyoung Kwak, Youngsuk Hwang, Jae-Min Shin, Dahyun Kim, Eun-Sun Yun, Kweon Jung, Ryoungme Ahn, Namsook Jo
Publikováno v:
Analytical Science and Technology. 29:249-254
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d05fa2cd24de0ba8ecfe634088efd45d
https://doi.org/10.5806/ast.2016.29.6.249
https://doi.org/10.5806/ast.2016.29.6.249
Autor:
Yeonsu Lee, Youngsuk Hwang, Hye-Lim Kang, Jung-Mu Kim, Ignacio Llamas-Garro, Sung-min Sim, Chi-Hyun Park
Publikováno v:
Micro and Nano Systems Letters, Vol 6, Iss 1, Pp 1-6 (2018)
In this paper, a stress and fracture study, occurring during the chemical mechanical polishing (CMP) of anodically bonded substrates is presented. The samples contain glass pillars, used to form the glass cavities and a silicon substrate sealing the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d0fd30e115dddb2fb2c556aab15aae9c
https://doi.org/10.1186/s40486-018-0075-0
https://doi.org/10.1186/s40486-018-0075-0