Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Youngju Lim"'
Autor:
Jong-Mil Youn, Kichang Sung, Ju-Heon Kim, Jeong-Hoon Ahn, Wonkyu Han, Junki Jang, Yun-Ki Choi, Woojin Jang, Hoon Kim, Chang-Hyun Kim, Hyunju Yim, Wonmo Kang, Rak-Hwan Kim, Youngju Lim, Young Soo Yoon, Dongwoo Shin
Publikováno v:
2021 IEEE International Interconnect Technology Conference (IITC).
We demonstrate that when a thin ALD (atomic layer deposition) TaN as a barrier metal is deposited to the Cu interconnect, the upper via resistance is significantly increased. We also exhibit that the abnormal upper via resistance is consistent with t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3001ed74dd45f03dcc568d479888c889
https://doi.org/10.1109/iitc51362.2021.9537395
https://doi.org/10.1109/iitc51362.2021.9537395
Publikováno v:
Journal of Economic Studies. 37:43-66
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9cc233d93cd069600d73ce0f6134ec5d
https://doi.org/10.30776/jes.37.1.3
https://doi.org/10.30776/jes.37.1.3
Autor:
Youngju Lim, SoonheeKwon
Publikováno v:
Journal of Speech Communication. :155-188
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bfa69f07d9a52ca3bfc41b4c365720a0
https://doi.org/10.18625/jsc.2018..41.155
https://doi.org/10.18625/jsc.2018..41.155
Publikováno v:
New Physics: Sae Mulli. 60:244-248
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::705420109d9ee07a699d834571a0e2b1
https://doi.org/10.3938/npsm.60.244
https://doi.org/10.3938/npsm.60.244