Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Youngbong Han"'
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 63:2105-2114
In this article, we propose a built-in ring differential transmission line for four-level pulse amplitude modulation (PAM4) signal integrity optimization. An optimized ring structure, which comes from the simplistic idea to leverage the voltage produ
Autor:
Jongwan Shim, SoYoung Kim, Youngbong Han, KwangMo Yang, TaeWoong Kim, Hung Khac Le, BumHee Bae
Publikováno v:
JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE. 21:311-321
Publikováno v:
IEIE Transactions on Smart Processing & Computing. 8:298-305
Publikováno v:
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).
In this paper, we propose a design methodology for multiple bus structures implemented on flexible printed circuit board (FPCB) with mesh ground structure. The proposed methodology suggested an optimum distance of the signal lines and relative locati
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 8:562-569
In this paper, a small electromagnetic bandgap structure that is suitable to be integrated into system-in-package is designed. The proposed structure, which is named as pinwheel perforated plane (PMPP), consists of meander line, mushroom-type patch,
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 8:546-553
As more circuit functions are integrated within a single die or small integrated package, the number of electromagnetic interference (EMI) problems caused by dc–dc converters is growing. In this paper, the dominant electromagnetic emission source o
Publikováno v:
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC).
As the available area for mounting components inside mobile devices gets smaller, the radio frequency interference (RFI) between high speed data transmission lines on the flexible printed circuit board (FPCB) and neighboring Wi-Fi antennas increases.
Publikováno v:
ICEIC
In this paper, we analyze the radio-frequency interference (RFI) between a camera module and antenna using 3D full-wave electromagnetic simulator. The amount of RFI to the victim antenna is evaluated using active S-parameters. Based on the analysis r
Publikováno v:
2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC).
Conventionally, EBG structures are used in the printed circuit boards (PCBs) level [1]. We proposed the Pinwheel Meander-line Perforated Plane (PMPP) structure as the solution [2]. In this paper, we modify the PMPP to reduce the area and electromagne
Publikováno v:
2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS).
As the market of wearable and internet of things (IoT) expands, there is a strong demand of shrinking the size of System-on-Package (SoP). In this paper, we propose a new electromagnetic bandgap structure (EBG) to mitigate the noise coupling within S