Zobrazeno 1 - 10
of 15
pro vyhledávání: '"YoungTak Lee"'
Publikováno v:
JTCVS Techniques.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fbbda96941055007ddefc0ed9674e3bf
https://doi.org/10.1016/j.xjtc.2023.03.001
https://doi.org/10.1016/j.xjtc.2023.03.001
Autor:
Youngtak Lee1, Doug Link1 doug_link@starkey.com
Publikováno v:
Journal of Microelectronic & Electronic Packaging. 2016 1st Quarter, Vol. 13 Issue 1, p1-5. 5p.
Autor:
Youngtak Lee, Douglas F. Link
Publikováno v:
International Symposium on Microelectronics. 2017:000201-000207
Due to rapid growth of the microelectronics industry, packaged devices with small form factors, low costs, high power performance, and increased efficiency have become of high demand in the market. To realize the current market development trend, fli
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a7b0162c3f7404cfd2dd0a23fe9a1fef
https://doi.org/10.4071/isom-2017-wa24_104
https://doi.org/10.4071/isom-2017-wa24_104
Autor:
Youngtak Lee, Douglas F. Link
Publikováno v:
International Symposium on Microelectronics. 2016:000111-000116
Due to rapid growth of the microelectronics industry, packaged devices with small form factors, low costs, high power performance, and increased efficiency have become of high demand in the market. To realize the current market development trend, fli
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::89ed4c72f5ad9f3c272b2f580edb7b99
https://doi.org/10.4071/isom-2016-tp53
https://doi.org/10.4071/isom-2016-tp53
Autor:
Douglas F. Link, Youngtak Lee
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 13:1-5
The demand for greater performance of hearing instruments in smaller form factors continues to drive the need for miniaturization of microelectronic packages. This article reports how through-silicon-via (TSV) technology was used to shrink the size o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4b9f8e736ff36124b32cb6ad18061310
https://doi.org/10.4071/imaps.497
https://doi.org/10.4071/imaps.497
Publikováno v:
ISQED
On-chip power delivery networks (PDNs) for today's microprocessors and systems-on-chip (SoCs), which are characterized by dynamic supply voltage, many embedded integrated VRs (IVRs), lower decoupling-capacitor, high current ranges, multiple power mod
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6e4d0002c0ffd6803e7ef4b080dc6af7
https://doi.org/10.1109/isqed.2014.6783308
https://doi.org/10.1109/isqed.2014.6783308
Publikováno v:
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2014.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::548c1febe27f2bebc20737e792d1ce7f
https://doi.org/10.7873/date.2014.160
https://doi.org/10.7873/date.2014.160
Autor:
Keysoo Shin, Ho-Jin Jeong, KeunHo Ryu, Bongsu Choi, Hankyo Seo, Youngtak Lee, Jeon Jeong-U, Ki-Tae Jeong
Publikováno v:
Fifth Asia-Pacific Conference on ... and Fourth Optoelectronics and Communications Conference on Communications.
We present a new method to flatten the gain profile of optical amplifiers; inserting an optical isolator in the middle of an Er doped fiber amplifier (EDFA). A flat gain bandwidth of more then 30 nm was experimentally obtained by this method. This is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fdd30854d3827105cc27f04064dbfdb4
https://doi.org/10.1109/apcc.1999.820516
https://doi.org/10.1109/apcc.1999.820516
Publikováno v:
MATEC Web of Conferences; 10/25/2016, Vol. 81, p1-5, 5p, 1 Color Photograph, 1 Chart, 6 Graphs
Publikováno v:
Fifteenth International Symposium on Quality Electronic Design; 01/01/2014, p68-75, 8p