Zobrazeno 1 - 10
of 46
pro vyhledávání: '"Young-Mog Ham"'
Publikováno v:
Microelectronic Engineering. :179-182
A new Monte Carlo simulator for low energy electron beam lithography was developed, which includes discrete energy loss models to represent secondary electron generation and straggling effects in energy loss. The models are based on the Moller cross-
Publikováno v:
Microelectronic Engineering. 35:125-128
A very highly sensitive resist is difficult to simulate its resist profile because of its extreme difference of development rate which can be determined from absorbed energy when electron beam is exposed. We developed resist profile simulator named E
Autor:
Wei Wu, Matt Lassiter, Chris Progler, Jonathan L. Cobb, Lloyd C. Litt, Young-Mog Ham, Will Conley, Kevin Lucas, Mike Cangemi, Bernie Roman, Marc Cangemi, Bryan S. Kasprowicz, Rand Cottle, Nicolo Morgana
Publikováno v:
SPIE Proceedings.
Today novel RET solutions are gaining more and more attention from the lithography community that is facing new challenges in attempting to meet the new requirement of the SIA roadmap. Immersion, high NA, polarization, and mask topography, are becomi
Autor:
Will Conley, Nicoló Morgana, Bryan S. Kasprowicz, Mike Cangemi, Matt Lassiter, Lloyd C. Litt, Marc Cangemi, Rand Cottle, Wei Wu, Jonathan Cobb, Young-Mog Ham, Kevin Lucas, Bernie Roman, Chris Progler
Publikováno v:
SPIE Proceedings.
Autor:
Young-Mog Ham, John Garcia, John Gookassian, Patrick M. Martin, Christopher J. Progler, Brian Dillon, Robert Pack, Mark E. Mason, Victor V. Boksha, Mitch Heins
Publikováno v:
SPIE Proceedings.
Time-to-mask (ttm) has been growing exponentially in the subwavelength era with the increased application of advanced RET's (Resolution Enhancement Technology). Not only are a greater number of design/mask layers impacted but more-and-more layers als
Autor:
Christopher J. Progler, Patrick M. Martin, Zongchang Yu, Rick Gray, Bryan S. Kasprowicz, Young-Mog Ham, James N. Wiley, Jun Ye
Publikováno v:
SPIE Proceedings.
Lithography simulation is an integral part of semiconductor manufacturing. It is not only required in lithography process development, but also in RET design, RET verification, and process latitude analysis, from library cells to full-chip tape out.
Publikováno v:
SPIE Proceedings.
In order to reduce mask making costs and improve wafer printability it is advantageous to determine machine parameters that will create highest probability of successful mask yield and mask image at CD and inspection. Proper simulation of actual prod
Autor:
Chris Progler, Young-Mog Ham, Wei Wu, Mark Smith, Lloyd C. Litt, Mike Cangemi, Rusty Carter, Rand Cottle, Bernie Roman, Jonathan L. Cobb, Kevin Lucas, Bryan S. Kasprowicz, Will Conley, Marc Cangemi, Matt Lassiter
Publikováno v:
Optical Microlithography XVIII.
The lithography prognosticator of the early 1980"s declared the end of optics for sub-0.5μm imaging. However, significant improvements in optics, photoresist and mask technology continued through the mercury lamp lines (436, 405 & 365nm) and into la
Autor:
Marc Cangemi, Lloyd C. Litt, Nicolo Morgana, Michael Cangemi, Christopher J. Progler, Young-Mog Ham, Rand Cottle, Will Conley, Wei Wu, Bernie Roman, Jonathan L. Cobb, Bryan S. Kasprowicz
Publikováno v:
Optical Microlithography XVIII.
Today the industry is filled with intensity-balanced c:PSM and much more focus is being placed on innovative approaches such as CPL (and in conjunction with IML for Contacts) and tunable transmission embedded attenuating phase shift mask (TT-EAPSM).
Autor:
Chang-Nam Ahn, Ki-Soo Shin, Wan-Ho Kim, Se-Young Oh, Hyoung-Soon Yune, Hee-Bom Kim, Seo-Min Kim, Young-Mog Ham
Publikováno v:
Digest of Papers. Microprocesses and Nanotechnology 2001. 2001 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.01EX468).
Lately, photolithography is seen as the bottleneck to sub-0.1 /spl mu/m patterning. Namely, the miniaturization of the design rule pushes the pattern sizes in the peripheral region as well as in the cell region into the resolution limit of exposure t