Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Young-Don Bae"'
Publikováno v:
IEEE Journal of Solid-State Circuits. 39:1101-1109
A low-power three-dimensional (3-D) rendering engine with two texture units and 29-Mb embedded DRAM is designed and integrated into an LSI for mobile third-generation (3G) multimedia terminals. Bilinear MIPMAP texture-mapped 3-D graphics can be reali
Autor:
Sungwon Shin, Sung-Eun Kim, Sungdae Choi, Hoi-Jun Yoo, Chi-Weon Yoon, Jin-Yong Chung, Kyung-Dong Yoo, Jeong-Ho Woo, In-Cheol Park, Ramchan Woo, Byeong-Gyu Nam, Seong-Jun Song, Ju-Ho Sohn, Young-Don Bae
Publikováno v:
IEEE Journal of Solid-State Circuits. 39:358-367
A 121-mm/sup 2/ graphics LSI is designed and implemented for portable two-dimensional (2-D) and three-dimensional (3-D) graphics and MPEG-4 applications. The LSI contains a RISC processor with a multiply-accumulate unit (MAC), a 3-D rendering engine,
Autor:
Hoi-Jun Yoo, Se-Joong Lee, Jeonghoon Kook, In-Cheol Park, Chi-Weon Yoon, Young-Don Bae, Langmin Lee, Ramchan Woo
Publikováno v:
IEEE Journal of Solid-State Circuits. 36:1758-1767
A low-power multimedia processor for mobile applications is presented. An 80-MHz 32-b RISC with enhanced multiplier, two 20-MHz hardware accelerators with 7.125-Mb embedded DRAM for MPEG-4 visual SP@L1 decoding and 3-D graphics processing, 2-kB dual-
Publikováno v:
2002 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.02CH37315).
This paper presents a single-chip programmable platform that integrates most of hardware blocks required in the design of embedded system chips. The platform includes a 32-bit multithreaded RISC processor (MT-RISC), configurable logic clusters (CLCs)
Autor:
null Ramchan Woo, null Sungdae Choi, null Ju-Ho Sohn, null Seong-Jun Song, null Young-Don Bae, null Hoi-Jun Yoo
Publikováno v:
ASP-DAC 2004: Asia and South Pacific Design Automation Conference 2004 (IEEE Cat. No.04EX753).
Autor:
Young-Don Bae, In-Cheol Park
Publikováno v:
CICC
This paper describes a configurable platform chip integrating 9 heterogeneous processors, which is designed to enable rapid prototyping and verification without translating functional behaviors into hardware blocks. The chip consists of a 32-bit mult
Autor:
null Ramchan Woo, null Sungdae Choi, null Ju-Ho Sohn, null Seong-Jun Song, null Young-Don Bae, null Chi-Weon Yoon, null Byeong-Gyu Nam, null Jeong-Ho Woo, null Sung-Eun Kim, null In-Cheol Park, null Sungwon Shin, null Kyung-Dong Yoo, null Jin-Yong Chung, null Hoi-Jun Yoo
Publikováno v:
2003 IEEE International Solid-State Circuits Conference, 2003. Digest of Technical Papers. ISSCC..
Autor:
null Chi-Weon Yoon, R. Woo, null Jeonghoon Kook, null Se-Joong Lee, null Langmin Lee, null Young-Don Bae, null In-Cheol Park, null Hoi-Jun Yoo
Publikováno v:
2001 IEEE International Solid-State Circuits Conference. Digest of Technical Papers. ISSCC (Cat. No.01CH37177).
Publikováno v:
2002 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.02CH37315); 2002, p268-501, 234p
Publikováno v:
IEEE Journal of Solid-State Circuits; Jul2004, Vol. 39 Issue 7, p1101-1109, 9p, 9 Black and White Photographs, 9 Diagrams, 1 Chart, 5 Graphs