Zobrazeno 1 - 10
of 17
pro vyhledávání: '"Young Seok Hong"'
Publikováno v:
Journal of the Korea Institute of Military Science and Technology. 18:326-334
This paper describes the verification and the validation about the development of the integrated interoperability system for live, virtual, and constructive simulations on the aircraft weapon system. The proposed integrated interoperability system pr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::af9cdd81ad08c59b27664af2f17bae3d
https://doi.org/10.9766/kimst.2015.18.3.326
https://doi.org/10.9766/kimst.2015.18.3.326
Publikováno v:
Engineering Optimization. 35:91-102
Despite the global optimization capability and low sensitivity to initial parameter estimates, evolutionary algorithms suffer from heavy computational loads especially when the fitness evaluation is time-consuming. The proposed acceleration method im
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3563b2c33a0a56c9312c16ad1a95b498
https://doi.org/10.1080/0305215031000069672
https://doi.org/10.1080/0305215031000069672
Publikováno v:
Journal of Economic Entomology. 84:825-829
Development of lariophagus distinguendus (Forster) parasitizing fourth instars of Sitophilus oryzae (L.) was studied in relation to temperature. As the temperature increased from 20 o to 32 o C, total developmental period of the female and male paras
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b1c1bceecbaf7b0bde8e64e38f8a7bf1
https://doi.org/10.1093/jee/84.3.825
https://doi.org/10.1093/jee/84.3.825
Autor:
Young Seok Hong, Mun Il Ryoo
Publikováno v:
Journal of Economic Entomology. 84:837-840
The functional and numerical response of Lartophagus distinguendus (Forster) to various densities of its host (fourth instar Sitophilus oryzae [L.]) were examined under five temperature conditions (20, 25, 28, 30°C, and room temperature). Temperatur
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::83992159a78a8e4acb489596c0896046
https://doi.org/10.1093/jee/84.3.837
https://doi.org/10.1093/jee/84.3.837
Autor:
Jeong-Taek Kong, Young-Seok Hong, Woo-Jin Jin, Moon-Hyun Yoo, Do-Wan Kim, Jong-bae Lee, Jae-Sam Shim, Chang-Woo Ko, Joon-Ho Choi
Publikováno v:
IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005..
Electromagnetic interference (EMI) has become more and more important in the electronics systems especially for household appliance. This paper describes a fast and accurate system-level simulation method for the EMI analysis of liquid crystal displa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6189859bf96283d734f0c4cbf1bfd3d5
https://doi.org/10.1109/epep.2005.1563743
https://doi.org/10.1109/epep.2005.1563743
Publikováno v:
ISQED
Due to the high speed and low power trends, the power distribution network (PDN) in multilayer printed circuit boards (PCBs) plays a pivotal role in terms of system performance. The paper presents an efficient analysis method for the irregularly shap
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8f508386de6ee1d39721819f79a66063
https://doi.org/10.1109/isqed.2005.19
https://doi.org/10.1109/isqed.2005.19
Publikováno v:
Proceedings. 8th IEEE Workshop on Signal Propagation on Interconnects.
The high speed and low power trend has imposed more and more importance on the design of the power distribution network (PDN) using multilayer printed circuit boards (PCBs) for modern microelectronic packages. This paper presents a fast and efficient
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::61f5025494f06faba0c31ef9eaae9618
https://doi.org/10.1109/spi.2004.1408994
https://doi.org/10.1109/spi.2004.1408994
Publikováno v:
ICVC '99. 6th International Conference on VLSI and CAD (Cat. No.99EX361).
In today's advanced semiconductor products, the width of the bus and the operating frequency increase. As a result, more simultaneous switching noise (SSN) is observed. However, SSN analysis requires the modeling of power and ground planes. The PEEC
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::31237a3fb0409001a4fa8d6392dd566f
https://doi.org/10.1109/icvc.1999.820825
https://doi.org/10.1109/icvc.1999.820825
Publikováno v:
IEEE Transactions on Advanced Packaging. May2005, Vol. 28 Issue 2, p168-173. 6p.
Publikováno v:
Sixth international Symposium on Quality Electronic Design (ISQED'05); 2005, p208-212, 5p