Zobrazeno 1 - 10
of 24
pro vyhledávání: '"Young Ki Ko"'
Publikováno v:
Journal of the Korean Society for Precision Engineering. 31:865-871
Paradigm shift to 3-D chip stacking in electronic packaging has induced a lot of integration challenges due to the reduction in wafer thickness and pitch size. This study presents a hybrid bonding technology by self-alignment effect in order to impro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7504b0448b5ebf14f927641b48818d85
https://doi.org/10.7736/kspe.2014.31.10.865
https://doi.org/10.7736/kspe.2014.31.10.865
Publikováno v:
Journal of Welding and Joining. 32:68-73
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c0e08cf27454207096195ace17ee3cd2
https://doi.org/10.5781/jwj.2014.32.3.68
https://doi.org/10.5781/jwj.2014.32.3.68
Publikováno v:
Journal of Welding and Joining. 32:19-26
Through Silicon Via (TSV) technology is the shortest interconnection technology which is compared with conventional wire bonding interconnection technology. Recently, this technology has been also noticed for the miniaturization of electronic devices
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::53b503a6ede97e065aba27e939b9cdb7
https://doi.org/10.5781/jwj.2014.32.3.19
https://doi.org/10.5781/jwj.2014.32.3.19
Publikováno v:
Materials Science Forum. :2758-2764
The development of 3D integration is necessarily required for high speed, high density, small size, and multi-functional electronic devices. Through silicon via (TSV) technology has been rapidly developed to fulfill the demand of the next generation
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3b033b2e1e056a94b874be7bd7feacc7
https://doi.org/10.4028/www.scientific.net/msf.783-786.2758
https://doi.org/10.4028/www.scientific.net/msf.783-786.2758
Publikováno v:
Journal of Alloys and Compounds. 583:155-161
Carbon nanotubes (CNTs) that incorporated Sn–3.5Ag solder balls were fabricated by a surface impact mixing (SIM) process. The SIM process consisted of a ball milling process that provided enough impact energy for CNT embedding on the solder surface
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::14c44775d267b50d093e27a3dba7d8ec
https://doi.org/10.1016/j.jallcom.2013.08.052
https://doi.org/10.1016/j.jallcom.2013.08.052
Publikováno v:
Journal of the Microelectronics and Packaging Society. 20:45-51
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::11d7595949815fba65f064ef0803aca5
https://doi.org/10.6117/kmeps.2013.20.3.045
https://doi.org/10.6117/kmeps.2013.20.3.045
Publikováno v:
Journal of Welding and Joining. 30:21-25
따라서 빠른 충진 시간을 갖는 충진 기술이 필요하며 빠른 충진 시간은 곧 생산성 증가로 연결되어 공정 비용을 낮추는 효과가 있다. 본 연구의 용융 솔더 충진 방법은 수초 이내의 짧은 시
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::304e79a8ce3a135572659117e2accf18
https://doi.org/10.5781/kwjs.2012.30.3.219
https://doi.org/10.5781/kwjs.2012.30.3.219
Publikováno v:
Journal of the Korean Welding and Joining Society. 29:14-18
이러한 장점은 지금까지 개발되어 온 3D 적층기술 중에서 TSV가 차세대 전자산업의 다양한 요구를 충족할 수 있는 기술로 부각되는 이유이다. 그러나 TSV의 높은 종횡비와 초미세 직경 등 구
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0fc2fe078d2c90042f99dd3f7100c2f6
https://doi.org/10.5781/kwjs.2011.29.3.270
https://doi.org/10.5781/kwjs.2011.29.3.270
Publikováno v:
Surface Review and Letters. 17:201-205
SiC -mixed Sn–58Bi composite solder bumps were successfully fabricated via an electroplating process. For the composite solder bump fabrication, ultrasonically dispersed SiC nanoparticles were added to the plating solutions. DSC analysis indicated
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9d6f7a11366530989ef9fdf106ce5c37
https://doi.org/10.1142/s0218625x10013795
https://doi.org/10.1142/s0218625x10013795
Publikováno v:
Materials Research Bulletin. 45:343-347
Nanocrystallized steel surface by micro-shot peening (MSP) were applied to carbon nanotube growth in this study. Micro-shot peening treatment severely deformed steel surface and nanocrystallized surface layer was formed by the plastic deformation. Th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9868ccf956e8679750723e52755fe392
https://doi.org/10.1016/j.materresbull.2009.12.026
https://doi.org/10.1016/j.materresbull.2009.12.026