Zobrazeno 1 - 10
of 430
pro vyhledávání: '"Younas R"'
Autor:
Price CC; Atomic Data Sciences, Boston, Massachusetts 02108, United States., Li Y; Department of Electrical Engineering, University of Notre Dame, Notre Dame, Indiana 46556, United States., Zhou G; Department of Electrical Engineering, University of Notre Dame, Notre Dame, Indiana 46556, United States., Younas R; Department of Electrical Engineering, University of Notre Dame, Notre Dame, Indiana 46556, United States., Zeng SS; Atomic Data Sciences, Boston, Massachusetts 02108, United States., Scanlon TH; Atomic Data Sciences, Boston, Massachusetts 02108, United States., Munro JM; Atomic Data Sciences, Boston, Massachusetts 02108, United States., Hinkle CL; Department of Electrical Engineering, University of Notre Dame, Notre Dame, Indiana 46556, United States.
Publikováno v:
Nano letters [Nano Lett] 2024 Nov 20; Vol. 24 (46), pp. 14862-14867. Date of Electronic Publication: 2024 Nov 12.
Autor:
Jadoon MZ; Pakistan Institute of Community Ophthalmology, Peshawar, Pakistan., Awan Z; CBM International, Islamabad, Pakistan., Moin M; College of Ophthalmology and Allied Vision Sciences, Lahore, Pakistan., Younas R; College of Ophthalmology and Allied Vision Sciences, Lahore, Pakistan., Latorre-Arteaga S; Peek Vision, Berkhamsted, UK.; Public Health Research Group, University of Alicante, Alicante, Spain., Watts E; Peek Vision, Berkhamsted, UK. elanor@peekvision.org.; Tennent Institute of Ophthalmology, Glasgow, UK. elanor@peekvision.org., Katibeh M; Peek Vision, Berkhamsted, UK.; Department of Ophthalmology, Faculty of Medicine, Aalborg University Hospital, Aalborg, Denmark., Bastawrous A; Peek Vision, Berkhamsted, UK.; International Centre for Eye Health, London School of Hygiene and Tropical Medicine, London, UK.
Publikováno v:
BMC primary care [BMC Prim Care] 2024 Jul 10; Vol. 25 (1), pp. 250. Date of Electronic Publication: 2024 Jul 10.
Autor:
Younas R; State Key Laboratory of Biobased Material and Green Papermaking, College of Food Science and Engineering, Qilu University of Technology, Shandong Academy of Science, Shandong, China.; Department of Chemistry, Govt College Women University, Faisalabad, Pakistan., Jubeen F; Department of Chemistry, Govt College Women University, Faisalabad, Pakistan., Bano N; Department of Physics and Astronomy College of Science, King Saud University, Riyadh, Saudi Arabia., Andreescu S; Department of Chemistry and Biomolecular Science, Clarkson University, Potsdam, New York, USA., Zhang H; State Key Laboratory of Biobased Material and Green Papermaking, College of Food Science and Engineering, Qilu University of Technology, Shandong Academy of Science, Shandong, China., Hayat A; State Key Laboratory of Biobased Material and Green Papermaking, College of Food Science and Engineering, Qilu University of Technology, Shandong Academy of Science, Shandong, China.; Interdisciplinary Research Centre in Biomedical Materials, COMSATS University Islamabad, Lahore, Punjab, Pakistan.
Publikováno v:
Biotechnology and bioengineering [Biotechnol Bioeng] 2024 Jul; Vol. 121 (7), pp. 2017-2049. Date of Electronic Publication: 2024 Apr 25.
Autor:
Kang JH; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA.; Department of Electronic Engineering, Inha University, Incheon, Republic of Korea., Shin H; School of Electrical and Electronic Engineering, Yonsei University, Seoul, Republic of Korea., Kim KS; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA., Song MK; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA., Lee D; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA., Meng Y; Department of Mechanical Engineering and Materials Science, Washington University in Saint Louis, Saint Louis, MO, USA., Choi C; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA.; Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, USA., Suh JM; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA., Kim BJ; School of Electrical and Electronic Engineering, Yonsei University, Seoul, Republic of Korea., Kim H; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA., Hoang AT; School of Electrical and Electronic Engineering, Yonsei University, Seoul, Republic of Korea., Park BI; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA., Zhou G; Department of Electrical Engineering, University of Notre Dame, Notre Dame, IN, USA., Sundaram S; School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA.; CNRS, Georgia Tech - CNRS IRL 2958, GT-Europe, Metz, France., Vuong P; CNRS, Georgia Tech - CNRS IRL 2958, GT-Europe, Metz, France., Shin J; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA., Choe J; School of Electrical and Electronic Engineering, Yonsei University, Seoul, Republic of Korea., Xu Z; Institute of Materials Science and Engineering, Washington University in Saint Louis, Saint Louis, MO, USA., Younas R; Department of Electrical Engineering, University of Notre Dame, Notre Dame, IN, USA., Kim JS; Institute of Materials Science and Engineering, Washington University in Saint Louis, Saint Louis, MO, USA., Han S; Department of Mechanical Engineering and Materials Science, Washington University in Saint Louis, Saint Louis, MO, USA., Lee S; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA., Kim SO; Department of Mechanical Engineering and Materials Science, Washington University in Saint Louis, Saint Louis, MO, USA., Kang B; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA., Seo S; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA., Ahn H; Future Innovation Research Center, Korea Aerospace Research Institute, Daejeon, Republic of Korea.; Aerospace System Engineering, University of Science and Technology, Daejeon, Republic of Korea., Seo S; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA., Reidy K; Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA., Park E; Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA., Mun S; Department of Industrial Engineering, Jeonju University, Jeonju, Republic of Korea.; Convergence Institute of Human Data Technology, Jeonju University, Jeonju, Republic of Korea., Park MC; Post-Silicon Semiconductor Institute, Korea Institute of Science and Technology, Seoul, Republic of Korea., Lee S; Post-Silicon Semiconductor Institute, Korea Institute of Science and Technology, Seoul, Republic of Korea., Kim HJ; Post-Silicon Semiconductor Institute, Korea Institute of Science and Technology, Seoul, Republic of Korea., Kum HS; School of Electrical and Electronic Engineering, Yonsei University, Seoul, Republic of Korea., Lin P; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA.; College of Computer Science and Technology, Zhejiang University, Hangzhou, China., Hinkle C; Department of Electrical Engineering, University of Notre Dame, Notre Dame, IN, USA., Ougazzaden A; School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA.; CNRS, Georgia Tech - CNRS IRL 2958, GT-Europe, Metz, France., Ahn JH; School of Electrical and Electronic Engineering, Yonsei University, Seoul, Republic of Korea. ahnj@yonsei.ac.kr., Kim J; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA. jeehwan@mit.edu.; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA. jeehwan@mit.edu.; Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA. jeehwan@mit.edu., Bae SH; Department of Mechanical Engineering and Materials Science, Washington University in Saint Louis, Saint Louis, MO, USA. sbae22@wustl.edu.; Institute of Materials Science and Engineering, Washington University in Saint Louis, Saint Louis, MO, USA. sbae22@wustl.edu.
Publikováno v:
Nature materials [Nat Mater] 2023 Dec; Vol. 22 (12), pp. 1470-1477. Date of Electronic Publication: 2023 Nov 27.
Autor:
Khan H; Medicine, Rehman Medical College, Peshawar, PAK., Irfan MS; Medicine and Surgery, Peshawar Medical College, Peshawar, PAK., Ullah G; Botany, Kohat University of Science and Technology, Kohat, PAK., Afnan M; Cardiovascular Medicine, Khyber Medical University Institute of Medical Sciences, Kohat, PAK., Younas R; General Surgery, Tehsil Headquarters (THQ) Hospital Mian Channu, Mian Channu, PAK.
Publikováno v:
Cureus [Cureus] 2023 Oct 04; Vol. 15 (10), pp. e46450. Date of Electronic Publication: 2023 Oct 04 (Print Publication: 2023).
Autor:
Lee S; Department of Electrical and Computer Engineering, University of Minnesota, Minneapolis, MN, 55455, USA., Seo D; Department of Electrical and Computer Engineering, University of Minnesota, Minneapolis, MN, 55455, USA., Park SH; Department of Electrical and Computer Engineering, University of Minnesota, Minneapolis, MN, 55455, USA., Izquierdo N; Department of Electrical and Computer Engineering, University of Minnesota, Minneapolis, MN, 55455, USA., Lee EH; Department of Electrical and Computer Engineering, University of Minnesota, Minneapolis, MN, 55455, USA., Younas R; Department of Electrical Engineering, University of Notre Dame, Notre Dame, IN, 46556, USA., Zhou G; Department of Electrical Engineering, University of Notre Dame, Notre Dame, IN, 46556, USA., Palei M; Department of Electrical Engineering, University of Notre Dame, Notre Dame, IN, 46556, USA., Hoffman AJ; Department of Electrical Engineering, University of Notre Dame, Notre Dame, IN, 46556, USA., Jang MS; School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, 34141, Republic of Korea., Hinkle CL; Department of Electrical Engineering, University of Notre Dame, Notre Dame, IN, 46556, USA., Koester SJ; Department of Electrical and Computer Engineering, University of Minnesota, Minneapolis, MN, 55455, USA. skoester@umn.edu., Low T; Department of Electrical and Computer Engineering, University of Minnesota, Minneapolis, MN, 55455, USA. tlow@umn.edu.; School of Physics and Astronomy, University of Minnesota, Minneapolis, MN, 55455, USA. tlow@umn.edu.
Publikováno v:
Nature communications [Nat Commun] 2023 Jul 01; Vol. 14 (1), pp. 3889. Date of Electronic Publication: 2023 Jul 01.
Autor:
Lin YC; Department of Materials Science and Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.; Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 300, Taiwan., Torsi R; Department of Materials Science and Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802, United States., Younas R; Department of Electrical Engineering, University of Notre Dame, Notre Dame, Indiana 46556, United States., Hinkle CL; Department of Electrical Engineering, University of Notre Dame, Notre Dame, Indiana 46556, United States., Rigosi AF; National Institute of Standards and Technology, Gaithersburg, Maryland 20899, United States., Hill HM; National Institute of Standards and Technology, Gaithersburg, Maryland 20899, United States., Zhang K; Department of Electrical and Computer Engineering, Rice University, Houston, Texas 77005, United States.; Department of Electrical Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802, United States., Huang S; Department of Electrical and Computer Engineering, Rice University, Houston, Texas 77005, United States.; Department of Electrical Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802, United States., Shuck CE; A.J. Drexel Nanomaterials Institute and Department of Materials Science and Engineering, Drexel University, Philadelphia, Pennsylvania 19104, United States., Chen C; Two-Dimensional Crystal Consortium, The Pennsylvania State University, University Park, Pennsylvania 16802, United States., Lin YH; Department of Chemical Engineering & Materials Science, Michigan State University, East Lansing, Michigan 48824, United States., Maldonado-Lopez D; Department of Chemical Engineering & Materials Science, Michigan State University, East Lansing, Michigan 48824, United States., Mendoza-Cortes JL; Department of Chemical Engineering & Materials Science, Michigan State University, East Lansing, Michigan 48824, United States., Ferrier J; Department of Physics and Chemical Engineering, Northeastern University, Boston, Massachusetts 02115, United States., Kar S; Department of Physics and Chemical Engineering, Northeastern University, Boston, Massachusetts 02115, United States., Nayir N; Two-Dimensional Crystal Consortium, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.; Department of Mechanical Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.; Department of Physics, Karamanoglu Mehmet University, Karaman 70100, Turkey., Rajabpour S; Department of Materials Science and Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802, United States., van Duin ACT; Department of Materials Science and Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.; Two-Dimensional Crystal Consortium, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.; Department of Mechanical Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.; Department of Chemical Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.; Department of Chemistry, The Pennsylvania State University, University Park, Pennsylvania 16802, United States., Liu X; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Jariwala D; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Jiang J; Department of Materials Science and Engineering, Rensselaer Polytechnic Institute, Troy, New York 12180, United States., Shi J; Department of Materials Science and Engineering, Rensselaer Polytechnic Institute, Troy, New York 12180, United States., Mortelmans W; Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02142, United States., Jaramillo R; Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02142, United States., Lopes JMJ; Paul-Drude-Institut für Festkörperelektronik, Leibniz-Institut im Forschungsverbund Berlin e.V., Hausvogteiplaz 5-7, 10117 Berlin, Germany., Engel-Herbert R; Paul-Drude-Institut für Festkörperelektronik, Leibniz-Institut im Forschungsverbund Berlin e.V., Hausvogteiplaz 5-7, 10117 Berlin, Germany., Trofe A; Department of Nanoscience, Joint School of Nanoscience & Nanoengineering, University of North Carolina at Greensboro, Greensboro, North Carolina 27401, United States., Ignatova T; Department of Nanoscience, Joint School of Nanoscience & Nanoengineering, University of North Carolina at Greensboro, Greensboro, North Carolina 27401, United States., Lee SH; Two-Dimensional Crystal Consortium, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.; Department of Physics, The Pennsylvania State University, University Park, Pennsylvania 16802, United States., Mao Z; Two-Dimensional Crystal Consortium, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.; Department of Physics, The Pennsylvania State University, University Park, Pennsylvania 16802, United States., Damian L; Department of Physics, University of North Texas, Denton, Texas 76203, United States., Wang Y; Department of Physics, University of North Texas, Denton, Texas 76203, United States., Steves MA; Institute for Quantitative Biosciences, University of California Berkeley, Berkeley, California 94720, United States., Knappenberger KL Jr; Department of Chemistry, The Pennsylvania State University, University Park, Pennsylvania 16802, United States., Wang Z; Two-Dimensional Crystal Consortium, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.; Department of Materials Science and Engineering, University of Delaware, Newark, Delaware 19716, United States., Law S; Department of Materials Science and Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.; Two-Dimensional Crystal Consortium, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.; Department of Materials Science and Engineering, University of Delaware, Newark, Delaware 19716, United States., Bepete G; Department of Chemistry, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.; Department of Physics, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.; Center for 2-Dimensional and Layered Materials, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.; Center for Atomically Thin Multifunctional Coatings, The Pennsylvania State University, University Park, Pennsylvania 16802, United States., Zhou D; Department of Physics, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.; Center for 2-Dimensional and Layered Materials, The Pennsylvania State University, University Park, Pennsylvania 16802, United States., Lin JX; Department of Physics, Brown University, Providence, Rhode Island 02906, United States., Scheurer MS; Institute for Theoretical Physics, University of Innsbruck, Innsbruck A-6020, Austria., Li J; Department of Physics, Brown University, Providence, Rhode Island 02906, United States., Wang P; Department of Physics, Princeton University, Princeton, New Jersey 08540, United States., Yu G; Department of Physics, Princeton University, Princeton, New Jersey 08540, United States.; Department of Electrical and Computer Engineering, Princeton University, Princeton, New Jersey 08540, United States., Wu S; Department of Physics, Princeton University, Princeton, New Jersey 08540, United States., Akinwande D; Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States.; Microelectronics Research Center, The University of Texas, Austin, Texas 78758, United States., Redwing JM; Department of Materials Science and Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.; Department of Electrical Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.; Two-Dimensional Crystal Consortium, The Pennsylvania State University, University Park, Pennsylvania 16802, United States., Terrones M; Department of Materials Science and Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.; Department of Chemistry, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.; Department of Physics, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.; Center for 2-Dimensional and Layered Materials, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.; Center for Atomically Thin Multifunctional Coatings, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.; Research Initiative for Supra-Materials and Global Aqua Innovation Center, Shinshu University, Nagano 380-8553, Japan., Robinson JA; Department of Materials Science and Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.; Two-Dimensional Crystal Consortium, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.; Department of Chemistry, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.; Department of Physics, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.; Center for 2-Dimensional and Layered Materials, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.; Center for Atomically Thin Multifunctional Coatings, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.
Publikováno v:
ACS nano [ACS Nano] 2023 Jun 13; Vol. 17 (11), pp. 9694-9747. Date of Electronic Publication: 2023 May 23.
Autor:
Afzal MI; School of Psychology, Northeast Normal University, Jilin, China. Electronic address: yiml822@nenu.edu.cn., Jamshaid S; School of Psychology, Northeast Normal University, Jilin, China. Electronic address: jiam093@nenu.edu.cn., Wang L; School of Psychology, Northeast Normal University, Jilin, China. Electronic address: wanglj699@nenu.edu.cn., Lo-Ngoen N; School of Psychology, Northeast Normal University, Jilin, China. Electronic address: naparut.lo-@mfu.ac.th., Olorundare A; School of Psychology, Northeast Normal University, Jilin, China. Electronic address: tonydare101@gmail.com., Iqbal M; Department of Psychology, School of Philosophy, Wuhan University, Wuhan, Hubei, China. Electronic address: mujahid@whu.edu.cn., Amin R; Department of Professional Psychology, Bahria University Islamabad, ICT, Pakistan. Electronic address: rizwana.buic@bahria.edu.pk., Younas R; University of Chinese Academy of Sciences, Zhongguancun, Beijing, China. Electronic address: romanaclpsy@gmail.com., Naz S; School of Psychology, Northeast Normal University, Jilin, China. Electronic address: sumairanaz125@gmail.com.
Publikováno v:
Acta psychologica [Acta Psychol (Amst)] 2023 Jun; Vol. 236, pp. 103924. Date of Electronic Publication: 2023 Apr 24.
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.
Autor:
Zhou G; Department of Electrical Engineering, University of Notre Dame, Notre Dame, Indiana46556, United States., Younas R; Department of Electrical Engineering, University of Notre Dame, Notre Dame, Indiana46556, United States., Sun T; Department of Electrical Engineering, University of Notre Dame, Notre Dame, Indiana46556, United States., Harden G; Department of Electrical Engineering, University of Notre Dame, Notre Dame, Indiana46556, United States., Li Y; Department of Electrical Engineering, University of Notre Dame, Notre Dame, Indiana46556, United States., Hoffman AJ; Department of Electrical Engineering, University of Notre Dame, Notre Dame, Indiana46556, United States., Hinkle CL; Department of Electrical Engineering, University of Notre Dame, Notre Dame, Indiana46556, United States.
Publikováno v:
ACS nano [ACS Nano] 2022 Nov 22; Vol. 16 (11), pp. 19385-19392. Date of Electronic Publication: 2022 Oct 24.