Zobrazeno 1 - 10
of 67
pro vyhledávání: '"Younan Hua"'
Publikováno v:
AIP Advances, Vol 11, Iss 12, Pp 125225-125225-8 (2021)
Recently, we have developed a spin Hall magnetoresistance (SMR) sensor featuring high-sensitivity, low-noise, zero-offset, and negligible hysteresis. Here, we demonstrate that the SMR sensor can be used to map the self-magnetic leakage field (SMLF) o
Externí odkaz:
https://doaj.org/article/124b14047b22407c87acadcdce4f617e
Publikováno v:
AIP Advances, Vol 8, Iss 11, Pp 115327-115327-11 (2018)
By in-situ transmission electron microscopy (TEM), we performed a detailed study on the electron-beam radiation damage to nanostructured silicon nitride thin-film process layers in a typical semiconductor NVM device. It was found that high-dose elect
Externí odkaz:
https://doaj.org/article/6f56e835d12142789c42c12c8151ced4
Autor:
Yihong Wu, Ying Wang, Jiayi Wang, Miao Zhou, Aihua Zhang, Chun Zhang, Yanjing Yang, Younan Hua, Baoxi Xu
Publikováno v:
AIP Advances, Vol 2, Iss 1, Pp 012132-012132-12 (2012)
Metal/two-dimensional carbon junctions are characterized by using a nanoprobe in an ultrahigh vacuum environment. Significant differences were found in bias voltage (V) dependence of differential conductance (dI/dV) between edge- and side-contact; th
Externí odkaz:
https://doaj.org/article/b70ddcf7e14b4a0eba8575561a796fbd
Application of deuterium oxide (D2O) isotope tracing technique for encapsulated QFN failure analysis
Autor:
Lois, Liao Jinzhi, Meng, Tian, Yong, Du, Qiang, Ji, Lei, Zhu, Xi, Zhang, Younan, Hua, Xiaomin, Li
Publikováno v:
In Microelectronics Reliability August 2022 135
Publikováno v:
International Symposium for Testing and Failure Analysis.
In wafer fabrication, silicon defects on the substrate directly affect the yield of the wafer. In this paper, we will study and discuss a chemical delayering and delineate method for silicon defects in wafer fabrication using Secco etch. It is well-k
Publikováno v:
International Symposium for Testing and Failure Analysis.
Currently, wire bonding is still the dominant interconnection mode in microelectronic packaging, and epoxy molding compound (EMC) is the major encapsulant material. Normally EMC contains chlorine (Cl) and sulfur (S) ions. It is important to understan
Autor:
Younan Hua, Lois Liao, Yanfei Zhao, Linhua Zhang, Tingting He, Yuanyuan Liu, Xi Zhang, Chao Fu, Xiaomin Li
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).