Zobrazeno 1 - 10
of 101
pro vyhledávání: '"Younan Hua"'
Application of deuterium oxide (D2O) isotope tracing technique for encapsulated QFN failure analysis
Autor:
Lois, Liao Jinzhi, Meng, Tian, Yong, Du, Qiang, Ji, Lei, Zhu, Xi, Zhang, Younan, Hua, Xiaomin, Li
Publikováno v:
In Microelectronics Reliability August 2022 135
Publikováno v:
AIP Advances, Vol 11, Iss 12, Pp 125225-125225-8 (2021)
Recently, we have developed a spin Hall magnetoresistance (SMR) sensor featuring high-sensitivity, low-noise, zero-offset, and negligible hysteresis. Here, we demonstrate that the SMR sensor can be used to map the self-magnetic leakage field (SMLF) o
Externí odkaz:
https://doaj.org/article/124b14047b22407c87acadcdce4f617e
Publikováno v:
AIP Advances, Vol 8, Iss 11, Pp 115327-115327-11 (2018)
By in-situ transmission electron microscopy (TEM), we performed a detailed study on the electron-beam radiation damage to nanostructured silicon nitride thin-film process layers in a typical semiconductor NVM device. It was found that high-dose elect
Externí odkaz:
https://doaj.org/article/6f56e835d12142789c42c12c8151ced4
Publikováno v:
International Symposium for Testing and Failure Analysis.
In wafer fabrication, silicon defects on the substrate directly affect the yield of the wafer. In this paper, we will study and discuss a chemical delayering and delineate method for silicon defects in wafer fabrication using Secco etch. It is well-k
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4f653e85b6eca0883a5235671fb8b22d
https://doi.org/10.31399/asm.cp.istfa2022p0365
https://doi.org/10.31399/asm.cp.istfa2022p0365
Publikováno v:
International Symposium for Testing and Failure Analysis.
Currently, wire bonding is still the dominant interconnection mode in microelectronic packaging, and epoxy molding compound (EMC) is the major encapsulant material. Normally EMC contains chlorine (Cl) and sulfur (S) ions. It is important to understan
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f21fbc0d6a03d32958a7d4bc04869f17
https://doi.org/10.31399/asm.cp.istfa2022p0374
https://doi.org/10.31399/asm.cp.istfa2022p0374
Autor:
Younan Hua, Lois Liao, Yanfei Zhao, Linhua Zhang, Tingting He, Yuanyuan Liu, Xi Zhang, Chao Fu, Xiaomin Li
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dee593ab89f98949ddb0cc1cbd16a57f
https://doi.org/10.1109/icept56209.2022.9873362
https://doi.org/10.1109/icept56209.2022.9873362
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ee1cbd3d3ca62f736ae5d235c4fa3d8d
https://doi.org/10.1109/icept56209.2022.9872588
https://doi.org/10.1109/icept56209.2022.9872588
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::17be0e345218fdf0288f34567446188e
https://doi.org/10.1109/icept56209.2022.9873106
https://doi.org/10.1109/icept56209.2022.9873106
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ef9b08e80ddcedb5b87fc3d92013c428
https://doi.org/10.1109/icept56209.2022.9873342
https://doi.org/10.1109/icept56209.2022.9873342
Publikováno v:
2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::084196eeaba32c9b9e72dca03e2a72f3
https://doi.org/10.1109/ipfa55383.2022.9915786
https://doi.org/10.1109/ipfa55383.2022.9915786