Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Youichi Kaneko"'
Autor:
Youichi Kaneko
Publikováno v:
Nihon Nyugan Kenshin Gakkaishi (Journal of Japan Association of Breast Cancer Screening). 12:134-139
Autor:
Youichi Kaneko
Publikováno v:
Nihon Nyugan Kenshin Gakkaishi (Journal of Japan Association of Breast Cancer Screening). 11:161-165
Autor:
Tetsuro Iwakura, Fujimoto Daisuke, Hikari Murai, Yamada Kumpei, Youichi Kaneko, Hiroshi Simizu
Publikováno v:
2013 3rd IEEE CPMT Symposium Japan.
As electronic parts increase its performance and miniaturize the size, package substrates are demanded to be thinner as well as higher in density. Thin packages such as Chip Scale Package (CSP) require high elastic modulus and low coefficient of ther
Autor:
Akishi Nakaso, Youichi Kaneko
Publikováno v:
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits. 11:189-193
多層プリント配線板の多層化接着前工程で行われる内層銅表面の黒化処理の耐酸性を向上させるために, 黒化処理後にNaBH4で化学還元する方法を検討した。その結果, 処理外観の均一性,
Autor:
Hirofumi Kawazumi, Tetsuo Kaneko, Takeshi Hidaka, Rumiko Saiki, Keiji Nakanishi, Shigefumi Toyofuku, Aki Hayata, Keinichi Kanno, Toshiyuki Hirayama, Morio Karube, Yayoi Oda, Youichi Kaneko, Susumu Kobori, Keiji Nakaishi
Publikováno v:
Journal of Sustainable Development. 4
The ‘United Nations Decade on Biodiversity 2011–2020’ started this year. Partnerships between universities and schools will be an important strategy for engaging in the ‘Decade on Biodiversity’. In this report, we describe a partnership bet
Autor:
Hikari Murai, Makoto Kato, Hiroyuki Fukai, Youichi Kaneko, Fujimoto Daisuke, Yamada Kunpei, Nobuyuki Ogawa
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
As electronic parts increase its performance and miniaturize in its size, package substrates are demanded to be thinner and higher in density. But higher density substrates using insulating films give higher warpage values when they are very thin, du
Autor:
Masatoyo Nakajo, Yoriko Kajiya, Tomoyo Kaneko, Youichi Kaneko, Takashi Takasaki, Atsushi Tani, Masako Ueno, Chihaya Koriyama, Masayuki Nakajo
Publikováno v:
European Journal of Nuclear Medicine & Molecular Imaging; Nov2010, Vol. 37 Issue 11, p2011-2020, 10p, 1 Color Photograph, 3 Charts, 2 Graphs
Publikováno v:
Circuit Technology. 3:164-169
半導体素子の高集積化, 電子機器の高性能化・小型化に伴い, 多層プリント配線板の高多層化・高密度化の要求がますます強くなってきた。このような状況の中で, プリプレグ樹脂と内層
Autor:
Hidehiro NOMURA, Mitsumasa NISHI, Takae KAWAJI, Youichi KANEKO, Sonshin TAKAO, Syunichiro OMODAKA
Publikováno v:
The Japanese Journal of Gastroenterological Surgery. 16:1302-1306