Zobrazeno 1 - 10
of 51
pro vyhledávání: '"Youchul Jeong"'
Publikováno v:
Remote Sensing, Vol 16, Iss 13, p 2275 (2024)
The consecutive submesoscale sea surface processes observed by an unmanned aerial vehicle (UAV) were used to decompose into spatial waves and current features. For the image decomposition, the Fast and Adaptive Multidimensional Empirical Mode Decompo
Externí odkaz:
https://doaj.org/article/5b969fc08896464fb821878871a1e5fd
Autor:
Jongjoo Shim, Youchul Jeong, Joungho Kim, Minchul Shin, Jun Ho Lee, Jaemin Kim, Jingook Kim, Chunghyun Ryu
Publikováno v:
IEEE Transactions on Advanced Packaging. 31:544-557
A hierarchical power distribution network (PDN) consists of chip, package, and printed circuit board (PCB) level PDNs, as well as various structures such as via, ball, and wire bond interconnections, which connect the different level PDNs. When estim
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aa648e4a6f80d79a9a64ce923c3abce0
https://doi.org/10.1109/tadvp.2008.927837
https://doi.org/10.1109/tadvp.2008.927837
Autor:
Jun So Pak, Joungho Kim, Hyungsoo Kim, Jongbae Park, Jingook Kim, Dong Gun Kam, Youchul Jeong
Publikováno v:
IEEE Transactions on Advanced Packaging. 29:548-559
The signal via is a heavily utilized interconnection structure in high-density System-on-Package (SoP) substrates and printed circuit boards (PCBs). Vias facilitate complicated routings in these multilayer structures. Significant simultaneous switchi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::216957c00a7ef886075d445af873f3b2
https://doi.org/10.1109/tadvp.2006.872996
https://doi.org/10.1109/tadvp.2006.872996
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 48:82-94
As multiple chips are being integrated into a single package with increased operating frequency, switching noise coupling on power buses has become an important design issue. To reduce the noise coupling, a split power bus structure has been generall
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::edd429578be7367248c96924c480de3a
https://doi.org/10.1109/temc.2006.870701
https://doi.org/10.1109/temc.2006.870701
Publikováno v:
Microwave and Optical Technology Letters. 48:358-361
We propose a method of analytical calculation of radi- ated emissions from a rectangular power bus using an embedded capac- itor. Using this method, the radiated emissions of the test package are calculated accurately and the calculation is verified
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8841270d2db7734288975bce0928f686
https://doi.org/10.1002/mop.21348
https://doi.org/10.1002/mop.21348
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
In Smart Mobile Devices, many components are integrated in a small space while each of them is operating at higher frequency ever. In the case of RF components, they are working at a specific single frequency, and it is relatively easy to avoid the i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::971942408800858707fc8d422f06983c
https://doi.org/10.1109/ectc.2014.6897369
https://doi.org/10.1109/ectc.2014.6897369
Publikováno v:
IEEE Microwave and Wireless Components Letters. 16:534-536
An accurate hybrid analytical method is proposed to determine the coupling of switching noise to signal traces in a multilayer power bus with embedded film capacitor. We used the induction equivalent theorem to derive the solution of noise coupling a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1b07fd5f127af1d44c2be753ce4f99e4
https://doi.org/10.1109/lmwc.2006.882405
https://doi.org/10.1109/lmwc.2006.882405
Publikováno v:
IEEE Microwave and Wireless Components Letters. 16:31-33
We propose a matrix substitution method for analyzing a power bus containing a power island in high-speed packages and printed circuit boards (PCBs). The method is based on a segmentation method and a resonant cavity model for a rectangular cavity, a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5b9a4e27e3197ef32467e2c5a4665fc4
https://doi.org/10.1109/lmwc.2005.861352
https://doi.org/10.1109/lmwc.2005.861352
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
Common-mode choke (CMC) is commonly used for filtering out common-mode noise. For differential interfaces, it is simple to select proper CMC by evaluating if CMC has high enough common-mode attenuation and low enough differential attenuation. However
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6e969741624d9dd26f9205f3eba6c388
https://doi.org/10.1109/ectc.2013.6575862
https://doi.org/10.1109/ectc.2013.6575862
Autor:
Seungyong Baek, Jongbae Park, Hyunjeong Park, Chang Wook Yoon, Baegin Sung, HyungRok Lee, Joungho Kim, Youchul Jeong
Publikováno v:
2008 IEEE-EPEP Electrical Performance of Electronic Packaging.
This paper introduces dual-slope signaling scheme to suppress EMI but sustain eye margin. The on-chip output driver is designed to generate high-speed and dual-slope signal using TSMC 0.18 CMOS process library. A 2.25 Gbps dual-slope signal suppresse
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6695922cad6d81a26d9ad3ef9e2243f8
https://doi.org/10.1109/epep.2008.4675898
https://doi.org/10.1109/epep.2008.4675898