Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Yoshiyuki Nagatomo"'
Autor:
Satoshi Takakuwa, Nobuyuki Terasaki, Naochika Kon, Touyou Ohashi, Nobuyasu Nita, Yoshiyuki Nagatomo, Yoshirou Kuromitsu
Publikováno v:
Journal of Materials Science: Materials in Electronics. 33:10486-10493
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c054136ef3e9b603de9e428469fdaf90
https://doi.org/10.1007/s10854-022-08035-w
https://doi.org/10.1007/s10854-022-08035-w
Autor:
Naochika Kon, Kevin M. Knowles, Nobuyuki Terasaki, Yoshiyuki Nagatomo, Hajime Chiba, Touyou Ohashi, Yoshirou Kuromitsu
Control of Ag electro chemical migration is crucial for long–term reliability of electrical components in high–voltage applications. In this work, Cu was bonded onto an AlN substrate at temperatures between 650 °C and 950 °C for 1 h using a Ag
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e6cebc1711e46a7727fa1276b9718855
Autor:
Nobuyuki Terasaki, Moe Sakaguchi, Hajime Chiba, Touyou Ohashi, Yoshiyuki Nagatomo, Yoshirou Kuromitsu, Tohru Sekino, Kevin M. Knowles
Interfacial reactions related to the TiN layer growth process between nanocrystalline epitaxial layers of AlN deposited on c-plane sapphire and a Ti–containing metal brazing or sintering layer using Ag–Cu–TiH2, Ag–TiH2 and Cu–TiH2 pastes ha
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7a0a770c428b41e6578c4b8b370443cf
https://www.repository.cam.ac.uk/handle/1810/338832
https://www.repository.cam.ac.uk/handle/1810/338832
Autor:
Yoshiyuki Nagatomo, Masahito Komasaki, K. Romanjek, Arai Koya, Yoshirou Kuromitsu, Shuji Nishimoto
Publikováno v:
Journal of Electronic Materials. 48:1976-1980
Thermoelectric modules with a π-structure were fabricated on four types of substrates, and their high-temperature durability was evaluated. A direct bonded aluminum (DBA) substrate was fabricated by using braze material in a vacuum furnace. In addit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aecae5507cb9a30c6acd84e670a59930
https://doi.org/10.1007/s11664-019-06998-x
https://doi.org/10.1007/s11664-019-06998-x
Publikováno v:
Microelectronics Reliability. 87:232-237
Currently, Ag die-attach techniques, using nano-silver particles, are of high interest for manufacturing of wide-band-gap (WBG) power module due to their high-temperature operation capability. However, the high cost of silver and complicated processi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e8954550d79aef3497a3f876815ea8a5
https://doi.org/10.1016/j.microrel.2018.06.010
https://doi.org/10.1016/j.microrel.2018.06.010
A new method for liquid-phase bonding of copper plates to an aluminum nitride (AlN) substrate was developed in this work. A newly developed proprietary interlayer composed of titanium and silver powders was deposited on the AlN substrate using a scre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7ff2db9a85f0b4e34046945e7c5de2c8
Autor:
Yoshirou Kuromitsu, Yoshiyuki Nagatomo, K. Romanjek, Shuji Nishimoto, Masahito Komasaki, Kimihito Nishikawa, Arai Koya
Publikováno v:
Engineering Failure Analysis. 120:105088
In this paper, the power generation characteristics for the thermoelectric modules operating at medium–high temperatures in air atmosphere are measured, and the effects of deterioration of insulated circuit substrates and the bonding layers are mea
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5e15df01f778493480d3e228850bc12c
https://doi.org/10.1016/j.engfailanal.2020.105088
https://doi.org/10.1016/j.engfailanal.2020.105088
Publikováno v:
Journal of the Ceramic Society of Japan. 125:165-167
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2092c09148c4ba5d7bb9f77462e415e3
https://doi.org/10.2109/jcersj2.16235
https://doi.org/10.2109/jcersj2.16235
Autor:
Yoshiyuki Nagatomo, Nobuyuki Terasaki, Tetsuya Tohei, Kei-ichiro Nayuki, Toshiyuki Nagase, Akihito Kumamoto, Naoya Shibata, Kazuhiro Akiyama, Yuichi Ikuhara, Yoshirou Kuromitsu
Publikováno v:
Scientific Reports
Liquid-phase bonding is a technologically important method to fabricate high-performance metal/ceramic heterostructures used for power electronic devices. However, the atomic-scale mechanisms of how these two dissimilar crystals specifically bond at
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::84a138bee6a93eb90c855bcad3573cec
https://doi.org/10.1038/srep22936
https://doi.org/10.1038/srep22936
Publikováno v:
Materials Science Forum. :3895-3900
Al circuit substrates, which are composed of a sintered AlN plate and pure Al plate joined to both sides of the AlN plate, are used for semiconductor power devices. It is important to prevent fracture of the Al/AlN interface to ensure normal and stab
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e03fa678316cba7621363cbfc3256fad
https://doi.org/10.4028/www.scientific.net/msf.638-642.3895
https://doi.org/10.4028/www.scientific.net/msf.638-642.3895