Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Yoshiyuki Morihiro"'
Publikováno v:
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits. 10:96-100
高密度実装基板の無洗浄化では, フラックスが残存するためイオンマイグレーションによる絶縁信頼性の低下が懸念される。そこで, フラックスに含まれる活性剤に着目し, 銅イオンとし
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::69cc1114d44ebcd9e467c18f1ac2f48d
https://doi.org/10.5104/jiep1995.10.96
https://doi.org/10.5104/jiep1995.10.96
Autor:
Kohei MURAKAMI, Akira ADACHI, Jitsuho HIROTA, Masaharu YOSHIDA, Osamu HAYASHI, Yoshiyuki MORIHIRO, Susumu HOSHINOUCHI
Publikováno v:
Journal of the Japan Society for Precision Engineering. 60:1806-1810
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9aaecdaf8d7df757ff5c118cb070a6c0
https://doi.org/10.2493/jjspe.60.1806
https://doi.org/10.2493/jjspe.60.1806
Publikováno v:
Journal of SHM. 10:34-38
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e109b6da42a6c6e07e17962c0965fe40
https://doi.org/10.5104/jiep1993.10.3_34
https://doi.org/10.5104/jiep1993.10.3_34
Autor:
Kohei Murakami, Yoshiyuki Morihiro, Osamu Hayashi, Akira Adachi, Jitsuho Hirota, Masaharu Yoshida, Susumu Hoshinouchi
Publikováno v:
Journal of the Japan Society for Precision Engineering. 59:1513-1518
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::900b232082cd79a1811d6a7ec0109506
https://doi.org/10.2493/jjspe.59.1513
https://doi.org/10.2493/jjspe.59.1513
Publikováno v:
International Congress on Applications of Lasers & Electro-Optics.
This paper describes the development of a new laser soldering technique for surface mount assemblies. The new technique, using a focused YAG laser beam, has superior performance. It can be applied to tape carrier package (TCP) assemblies for fine pit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::334534e6f461cad6f1ccfbb1fd1998ee
https://doi.org/10.2351/1.5058814
https://doi.org/10.2351/1.5058814
Autor:
Hiroshi Kurokawa, Kurumi Miyake, Mori Mitsumasa, Masahiro Nunoshita, Yoshiyuki Morihiro, Masanobu Kohara
Publikováno v:
MRS Proceedings. 227
A polyimide (PI) surface is analyzed by XPS at each electroless-copper-plating step. Zn ions are adsorbed on the PI surface, and subsequently replaced with Pd ions. Cu is deposited on the PI surface catalyzed by these Pd ions, As the surface concentr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7f01462154694989525305f005744c61
https://doi.org/10.1557/proc-227-357
https://doi.org/10.1557/proc-227-357
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