Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Yoshitaka Otsubo"'
Publikováno v:
International Symposium on Microelectronics. 2018:000470-000475
Press-fit technology has been expected as a mounting technique instead of soldering in power electronics. To apply press-fit technology to power modules, the basic behavior of the contact resistance and an interface reaction of the press-fit contact
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::db3e96ee9e244fa85ca5740c2a3a85f1
https://doi.org/10.4071/2380-4505-2018.1.000470
https://doi.org/10.4071/2380-4505-2018.1.000470
Publikováno v:
Journal of Smart Processing. 7:139-145
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ea055907026a99a1a3ce023fe7c043b4
https://doi.org/10.7791/jspmee.7.139
https://doi.org/10.7791/jspmee.7.139
Autor:
Kaji Yusuke, Shinsuke Asada, Yasumichi Hatanaka, Seiki Hiramatsu, Kondo Satoshi, Yoshitaka Otsubo
Publikováno v:
2016 28th International Symposium on Power Semiconductor Devices and ICs (ISPSD).
A newly IGBT module combined with liquid epoxy resin encapsulation and insulating metal baseplate (IMB) has been developed. IMB is insulating sheet with thick baseplate, and has large mounting area compared to ceramic substrate. The properties of liq
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::18edd940af93dd3d71a00138eb4f568e
https://doi.org/10.1109/ispsd.2016.7520881
https://doi.org/10.1109/ispsd.2016.7520881
Autor:
Yoshitaka Otsubo
Publikováno v:
Journal of the Fuel Society of Japan. 36:913-924
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c2662a79c20fa5d18b88f45069a495aa
https://doi.org/10.3775/jie.36.12_913
https://doi.org/10.3775/jie.36.12_913