Zobrazeno 1 - 10
of 93
pro vyhledávání: '"Yoshitaka NISHIMURA"'
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 6:1139-1147
Power semiconductor devices for electric power conversion are operated at high temperatures and must exhibit high reliability. Therefore, high heat resistance and long fatigue lifetimes are necessary for the solder joints in these devices. In this pa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::79c174817eb4659396d9b61172acb1a2
https://doi.org/10.1109/tcpmt.2016.2582599
https://doi.org/10.1109/tcpmt.2016.2582599
Publikováno v:
Journal of Smart Processing. 4:46-50
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2257ac0cd193717d484de278b958aa56
https://doi.org/10.7791/jspmee.4.46
https://doi.org/10.7791/jspmee.4.46
Publikováno v:
Transactions of The Japan Institute of Electronics Packaging. 8:8-17
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ff0747d8af6b6d48894a96f9bd7b768b
https://doi.org/10.5104/jiepeng.8.8
https://doi.org/10.5104/jiepeng.8.8
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 17:464-468
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::425d687cfe564d274244d8377b4c611c
https://doi.org/10.5104/jiep.17.464
https://doi.org/10.5104/jiep.17.464
Autor:
Yoshitaka Nishimura
Publikováno v:
TRENDS IN THE SCIENCES. 24:11_43-11_45
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9eff86d1e1b1d20487c5c7306b2fb27e
https://doi.org/10.5363/tits.24.11_43
https://doi.org/10.5363/tits.24.11_43
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 16:341-346
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ade748c0f0d2a706defae6bbe8ceb2ad
https://doi.org/10.5104/jiep.16.341
https://doi.org/10.5104/jiep.16.341
Publikováno v:
2016 IEEE CPMT Symposium Japan (ICSJ).
It is expected to be effective for global environmental conservation and energy saving that power electronics technology introduce to a variety of areas of electric power conversion system, such as electric and hybrid electric vehicle (EV/HEV), IT/CP
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5a66e5e6db62b0f39699009ccdd84c6e
https://doi.org/10.1109/icsj.2016.7801243
https://doi.org/10.1109/icsj.2016.7801243
Autor:
Hiroaki Hokazono, Akira Morozumi, Yoshitaka Nishimura, Yoshikazu Takahashi, Eiji Mochizuki, Yoshiharu Kariya
Publikováno v:
2016 International Conference on Electronics Packaging (ICEP).
Power semiconductor devices for electric power conversion must be highly efficient, compact, and with large capacity. Therefore, highly thermo stability and long fatigue lifetime are necessary for the joint materials of these devices. In this paper,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f5156905029d870602d177f12959b844
https://doi.org/10.1109/icep.2016.7486857
https://doi.org/10.1109/icep.2016.7486857
Publikováno v:
JOURNAL OF THE JAPAN WELDING SOCIETY. 80:289-293
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bd92015023025460838a7865acdc8784
https://doi.org/10.2207/jjws.80.289
https://doi.org/10.2207/jjws.80.289
Publikováno v:
Journal of the Ceramic Society of Japan. 118:1032-1037
A textured alumina was fabricated from anisotropic α-alumina particles (platelets) by heating at 1650°C for 15 min under applied pressure of 60 MPa using a PECS (Pulse Electric Current Sintering) technique. Subsequently, the thermal conductivity, m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eda88d3e709b9a7aea83c7f39fe0302f
https://doi.org/10.2109/jcersj2.118.1032
https://doi.org/10.2109/jcersj2.118.1032