Zobrazeno 1 - 10 of 275 pro vyhledávání: '"Yoshio, Murakami"'
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Akademický článek
Piston Ring Projection and Catching in Cylinder Ports of Two-Stroke Cycle Engine
Autor: Kohei NAKASHIMA, Kazuki FUMA, Daisuke KUROKAWA, Yuki NAKANO, Yoshio MURAKAMI, Masago YAMAMOTO
Publikováno v: Journal of Advanced Mechanical Design, Systems, and Manufacturing, Vol 6, Iss 1, Pp 23-32 (2012)
In a two-stroke cycle engine, the piston and its piston rings slide over the cylinder wall and its cylinder ports. This study investigates how those piston rings project and catch in cylinder ports, and examines the effects of engine speed and round
Externí odkaz: https://doaj.org/article/a7819e641e3f40aba75b923a2737d9b3
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3
Warpage and Thermal Stress under Thermal Cycling Test in SiC and Si Power Device Structures Using Direct Chip-Bonding with Ag Sintered Layer on Cu Plate
Autor: Mutsuharu Tsunoda, Akihiro Mochizuki, Yoshio Murakami, Nobuhiko Nakano, Masaaki Aoki, Masaki Kanemoto
Publikováno v: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
This work clarifies the warpage and thermal stress under thermal cycling test (TCT) by 3D multi-physics solver for SiC and Si power device chip systems using direct Ag sintering chip-attachment on Cu plate. We compare the simulated warpages to the wa
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::2a7effa70a46f682733d5de604a1a5d5
https://doi.org/10.1109/ectc.2018.00049
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4
Comparison of thermal stress under TCT between SiC and Si power devices using direct chip-bonding with ag sintered layer on Cu plate
Autor: Yoshio Murakami, Masaki Kanemoto, Masaaki Aoki, Mutsuharu Tsunoda, Goro Yoshinari, Nobuhiko Nakano, Akihiro Mochizuki
Publikováno v: 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).
This work clarifies the thermal stress profiles and concentrations under thermal cycling test by 3D multi-physics solver for SiC and Si power device chip systems using Ag sintering chip-attachment on Cu plate. A comparison analysis between SiC and Si
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::c47e9f3d5c173652cd2fa97653a90a54
https://doi.org/10.1109/edaps.2017.8276946
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5
Thermal stress analysis under thermal cycling test for SiC power device heat dissipation structures using Ag sintered layer
Autor: Nobuhiko Nakano, Masaaki Aoki, Yoshio Murakami, Akihiro Mochizuki, Kensuke Osonoe, Goro Yoshinari, Hitoshi Kida
Publikováno v: 2017 International Conference on Electronics Packaging (ICEP).
We have analyzed 3D thermal stress profile under TCT using multi-physics solver for SiC power device heat dissipation structures with a direct chip bonding on Cu plate by Ag sintered layer. The results showed that the maximum stress value in SiC chip
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::0ebcf8abcdcc914c601557661da21cfc
https://doi.org/10.23919/icep.2017.7939443
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7
Stress Concentration and Profile under Thermal Cycling Test in Power Device Heat Dissipation Structures Using Double-Side Chip Bonding with Ag Sintered Layer on Cu Plate
Autor: Masaaki Aoki, Nobuhiko Nakano, Kensuke Osonoe, Goro Yoshinari, Yoshio Murakami, Takahiro Asai, Hitoshi Kida
Publikováno v: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Power semiconductor devices and modules need highly efficient heat dissipation system having a chip bonding layer with high thermal conductance and reliability. Ag sintering chip-attachment has several advantages for heat dissipation. This work clari
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::0f3bd4434a4370a9305513e72ae1ab2b
https://doi.org/10.1109/ectc.2016.79
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8
Piston Ring Projection and Catching in Cylinder Ports of Two-Stroke Cycle Engine
Autor: Yuki Nakano, Masago Yamamoto, Yoshio Murakami, Kohei Nakashima, Kazuki Fuma, Daisuke Kurokawa
Publikováno v: Journal of Advanced Mechanical Design, Systems, and Manufacturing. 6:23-32
In a two-stroke cycle engine, the piston and its piston rings slide over the cylinder wall and its cylinder ports. This study investigates how those piston rings project and catch in cylinder ports, and examines the effects of engine speed and round
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::299baa81b3b306202894ad6dcc56c26d
https://doi.org/10.1299/jamdsm.6.23
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