Eutectic Zn-Al Die Attachment for Higher Tj SiC Power Applications: Fabrication Method and Die Shear Strength Reliability.

Autor: Satoshi Tanimoto, Kohei Matsui, Yusuke Zushi, Shinji Sato, Yoshinori MurakamiA, Masato Takamori, Takashi Iseki

Publikováno v: Journal of Microelectronic & Electronic Packaging; 2013 2nd Quarter, Vol. 10 Issue 2, p59-66, 8p