Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Yoshinori Hotta"'
Publikováno v:
Journal of the Japan Society of Engineering Geology. 59:273-280
Publikováno v:
3DIC
In this work, we demonstrated Cu-Cu bonding with an inorganic anisotropic conductive film called ‘i-ACF’ composed of an anodized aluminum oxide (AAO) film with a huge number of 60-nm-diameter Cu nano-pillars (CNPs). Lower-temperature/pressure Cu-
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 18:503-510
Publikováno v:
3DIC
The unique bonding between Cu and Cu will be reported. The material was prepared by filling metal Cu into isolated nano-holes of anodized aluminum oxide (AAO). Nano-Cu filaments were exposed from AAO surface. The electric conductivity appears only in
Publikováno v:
2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC).
Copper-filled anodized aluminum oxide (Cu-filled AAO) will be presented as a potential base material for bonding between the small pads of IC chips. This paper presents a potential material for low temperature bonding for 3D packaging. The material w
Publikováno v:
Analytical Sciences. 8:527-531
A system has been developed which can simultaneously determine the size of individual airborne particles and the content of a given element in them. An aerosol sample was passed through a laser light-scattering cell in order to measure the size of in
Publikováno v:
BUNSEKI KAGAKU. 36:453-455
An image dissector tube with a slit aperture (17μm ×3mm) was attached to a 1-m Ebert type spectrograph whose plate holder and racking mechanism were removed. Almost flat responses were obtained along the horizontal axis of the photocathode (16mm lo