Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Yoshinori Ejiri"'
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 23:230-238
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3e9e335467168aa35d8cbbdee5d625b1
https://doi.org/10.5104/jiep.23.230
https://doi.org/10.5104/jiep.23.230
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 21:224-233
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b5cea5b125ba6ca48cd8b233453b66d3
https://doi.org/10.5104/jiep.21.224
https://doi.org/10.5104/jiep.21.224
Publikováno v:
International Symposium on Microelectronics. 2017:000742-000746
Panel level packages such as 2.1D organic interposer and fan-out packages have been attracting the attention as a low cost substrate technology with high density fine wiring layers which interconnect multiple die set side by side. The Cu trench wirin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9fa7cc9139413c6389a5e9095a1b3b08
https://doi.org/10.4071/isom-2017-thp41_007
https://doi.org/10.4071/isom-2017-thp41_007
Autor:
Kurihara Yoshiaki, Kosuke Urashima, Shinichirou Sukata, Motoki Yonekura, Takaaki Noudou, Masaya Toba, Hiroshi Masuda, Yoshinori Ejiri
Publikováno v:
2019 Pan Pacific Microelectronics Symposium (Pan Pacific).
Cu particles with an average particle size of 130 nm were found to be suitable for low-temperature metallization. Cu wirings with line/space $(\mathrm{L}/\mathrm{S}) = 150 \mu \mathrm{m}/150 \mu {\mathrm {m}}~and~{\mathrm {L/S}} = 150 \mu m/100 \mu {
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9c8b34057b4cb49fb21dbf0b86e23c08
https://doi.org/10.23919/panpacific.2019.8696671
https://doi.org/10.23919/panpacific.2019.8696671
Autor:
Kazuyuki Mitsukura, Masaya Toba, Kousuke Urashima, Yoshinori Ejiri, Kenichi Iwashita, Tomonori Minegishi, Kazuhiko Kurafuchi
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 14:26-31
An organic interposer technology with ultrafine line and space is required to achieve high-density interconnection between chips. In this article, we propose a high reliability, ultrafine trench wiring process. Currently, trench wiring is made by las
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::db53d5856e36d8d5f2563a9f6b2c7032
https://doi.org/10.4071/imaps.348184
https://doi.org/10.4071/imaps.348184
Autor:
Kazuyuki Mitsukura, Kenichi Iwashita, Kazuhiko Kurafuchi, Yoshinori Ejiri, Tomonori Minegishi, Kousuke Urashima, Masaya Toba
Publikováno v:
International Symposium on Microelectronics. 2016:000165-000170
An organic interposer technology with ultra-fine line and space is required in order to achieve high density interconnection between chips. In this paper we propose a high reliability, ultra-fine trench wiring process. Current trench wiring is made b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8ce4b4878c8042665a49eaa72bab8c0a
https://doi.org/10.4071/isom-2016-wa23
https://doi.org/10.4071/isom-2016-wa23
Autor:
Bao Ngoc An, Kawana Yuki, Helge Wurst, Suguru Ueda, Sugama Chie, Negishi Motohiro, Benjamin Leyrer, Yoshinori Ejiri, Thomas Blank, Dai Ishikawa, Hideo Nakako, Marc Weber
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
this paper describes the sintering properties and bonding properties of copper (Cu) die-bonding sinter paste for power devices operating at high temperatures. The Cu paste can be sintered pressure less in 100% H2 or under pressure in 100% N2 atmosphe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3f10e7d3404b806331e10ca864648dd2
https://doi.org/10.1109/estc.2018.8546455
https://doi.org/10.1109/estc.2018.8546455
Publikováno v:
2018 Pan Pacific Microelectronics Symposium (Pan Pacific).
We investigated the influence of Pd film thickness in electroless nickel/electroless palladium/immersion gold (ENEPIG) plating on the intermetallic compound (IMC) growth and the solder joint reliability (SJR). We found that (Cu, Ni, Pd) 3 Sn and (Cu,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::53fb7ef93489e5f5a68ab7a188ea7803
https://doi.org/10.23919/panpacific.2018.8319014
https://doi.org/10.23919/panpacific.2018.8319014
Autor:
Kiyoshi Hasegawa, Takehisa Sakurai, Yoshinori Arayama, Yoshinori Ejiri, Yoshiaki Tsubomatsu, Takaaki Noudou, Akio Takahashi
Publikováno v:
Journal of Smart Processing. 5:221-228
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b0d0dbc370f26301354be932d7c6ba6e
https://doi.org/10.7791/jspmee.5.221
https://doi.org/10.7791/jspmee.5.221
Autor:
Yoshinori Ejiri1, Takehisa Sakurai1, Yoshinori Arayama1, Yoshiaki Tsubomatsu1, Kiyoshi Hasegawa1
Publikováno v:
SMT: Surface Mount Technology. Jan2017, Vol. 32 Issue 1, p54-63. 9p.