Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Yoshikuni Tateyama"'
Autor:
Hajime Eda, Masabumi Masuko, Yukiteru Matsui, Takeshi Nishioka, Hiroyuki Yano, Satoko Seta, Yoshikuni Tateyama, Takatoshi Ono
Publikováno v:
Journal of The Electrochemical Society. 157(No. 5)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ab4560e712d4f1ced0586092ca3e5439
http://t2r2.star.titech.ac.jp/cgi-bin/publicationinfo.cgi?q_publication_content_number=CTT100610001
http://t2r2.star.titech.ac.jp/cgi-bin/publicationinfo.cgi?q_publication_content_number=CTT100610001
Autor:
Gaku Minamihaba, Yukiteru Matsui, Yoshikuni Tateyama, Atsushi Shigeta, Hiroyuki Yano, Nobuo Hayasaka, Takeshi Nishioka, K. Takahata
Publikováno v:
Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005..
In order to reduce the focus error for the stacked mask process (SMAP) used in Cu/low-k dual damascene (DD) interconnect, a planarization technology of the under layer film by CMP was developed. Photo-resist was used for the under layer film. CMP slu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3d8f2d444b45acbb310cc2537b69f164
https://doi.org/10.1109/iitc.2005.1499963
https://doi.org/10.1109/iitc.2005.1499963
Autor:
Takashi Kawakami, Hiroshi Ohtani, Satoko Iwami, Takeshi Nishioka, Yoshikuni Tateyama, Naoto Miyashita
Publikováno v:
MRS Proceedings. 613
Chemical mechanical polishing is an essential process for achieving a high degree of planarization. The planarity after CMP sensitively depends on pattern scales, pattern densities and mechanical properties of polishing pads. In order to simulate the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::21b35139bd429a0abc135833fbcf16c2
https://doi.org/10.1557/proc-613-e1.5.1
https://doi.org/10.1557/proc-613-e1.5.1
Autor:
Masako Kinoshita, Hirotaka Shida, Masabumi Masuko, Yoshikuni Tateyama, Atsushi Shigeta, Hiroyuki Yano, Satoko Seta, Yukiteru Matsui, Kazuo Nishimoto, Takeshi Nishioka
Publikováno v:
Journal of The Electrochemical Society. 156:H548
High performance photoresist planarization technology by chemical mechanical polishing (CMP) was developed for the trench-first Cu/low-k dual damascene (DD) process to reduce the focus error in the lithography process. To improve the planarity for th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::76b20c787236b1e973efd66b4ed8b862
https://doi.org/10.1149/1.3122883
https://doi.org/10.1149/1.3122883
Publikováno v:
Bulletin of the Chemical Society of Japan. 61:2805-2810
The title complexes have been synthesized, and their crystal and molecular structures were determined by the X-ray diffraction method using their single crystals. Among them, the crystals of the La, Ce, and Pr complexes are isomorphous; cubic, space
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::caa3585ce2cee14f8da52e327a90e3f7
https://doi.org/10.1246/bcsj.61.2805
https://doi.org/10.1246/bcsj.61.2805
Publikováno v:
Journal of the Less Common Metals. 149:179-184
The precipitation pH values of the lanthanoid(III) hydroxides from chloride and perchlorate solutions were determined at 25.0 °C by electrolytic hydroxide formation together with the optical scattering method of detecting precipitate, and compared w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d1b9172eacc4bb2876028ca402b7b9ff
https://doi.org/10.1016/0022-5088(89)90483-9
https://doi.org/10.1016/0022-5088(89)90483-9
Publikováno v:
Bulletin of the Chemical Society of Japan. 61:2214-2216
The crystal and molecular structures of the title complex has been determined by the single-crystal X-ray diffraction method. It is monoclinic, with the space group Pn, Z=2 (including 4 metal atoms), a=28.90(2), b=10.251(4), c=5.981(1) A, and β=94.6
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::483e5bca8d9684643092c6910042ed0b
https://doi.org/10.1246/bcsj.61.2214
https://doi.org/10.1246/bcsj.61.2214